Lin-Ko Feng

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Test line placement to improve die sawing quality
- Patent number 8,993,355
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test line placement to improve die sawing quality
- Patent number 8,519,512
- Issue date Aug 27, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Test Line Placement to Improve Die Sawing Quality
- Publication number 20130316471
- Publication date Nov 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test line placement to improve die sawing quality
- Publication number 20080073753
- Publication date Mar 27, 2008
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS