LIN LIN

Follow

Person

CHENGDU CITY, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Bond pad stack for transistors
- Patent number 9,030,023
- Issue date May 12, 2015
- Texas Instruments Incorporated
- Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bond pad stack for transistors
- Patent number 8,815,730
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC FABRICATION FLOW WITH CONTINUOUS DYNAMIC SAMPLING FOR AUTO-VISUA...
- Publication number 20240071837
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STACK FOR TRANSISTORS
- Publication number 20150008511
- Publication date Jan 8, 2015
- TEXAS INSTRUMENTS INCORPORATED
- JING WANG
- H01 - BASIC ELECTRIC ELEMENTS