Lin Lv

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Shanghai, CN

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR RIGID CHIP-SCALE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20250070049
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...
- Publication number 20250069973
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HIGH METAL BUMPS AND ULTRA-THIN SUBSTR...
- Publication number 20250070069
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE
- Publication number 20230307325
- Publication date Sep 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS