Lin-Min Hung

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Longtan Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for post-bonding wafer edge seal
- Patent number 8,841,201
- Issue date Sep 23, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method to Produce Chemical Pattern In Micro-Fluidic Structure
- Publication number 20200070153
- Publication date Mar 5, 2020
- Illumina, Inc.
- Shang-Ying Tsai
- B82 - NANO-TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR POST-BONDING WAFER EDGE SEAL
- Publication number 20140231967
- Publication date Aug 21, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY