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Hong Kong, HK
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last 30 patents
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Patent Grant
Integrated circuit package and method of manufacturing the integrat...
Patent number
6,940,154
Issue date
Sep 6, 2005
ASAT Limited
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Integrated circuit package and method of manufacturing the integrat...
Publication number
20030234454
Publication date
Dec 25, 2003
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method of manufacturing an encapsulated integrated circuit package
Publication number
20030143776
Publication date
Jul 31, 2003
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS