Lin-Wei Wang

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for separating wafer from carrier
- Patent number 9,735,039
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative multi-purpose dipping plate
- Patent number 9,700,950
- Issue date Jul 11, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for cutting semiconductor wafers
- Patent number 8,940,618
- Issue date Jan 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method of separating wafer from carrier
- Patent number 8,834,662
- Issue date Sep 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Package assembly cleaning process using vaporized solvent
- Patent number 8,702,871
- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- B08 - CLEANING
Information Patent Grant
Forming low stress joints using thermal compress bonding
- Patent number 8,616,433
- Issue date Dec 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming low stress joints using thermal compress bonding
- Patent number 8,360,303
- Issue date Jan 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR SEPARATING WAFER FROM CARRIER
- Publication number 20140360671
- Publication date Dec 11, 2014
- Chien Ling HWANG
- B32 - LAYERED PRODUCTS
Information Patent Application
Innovative Multi-Purpose Dipping Plate
- Publication number 20140048586
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and Method for the Singulation of a Semiconductor Wafer
- Publication number 20130273717
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF SEPARATING WAFER FROM CARRIER
- Publication number 20130248119
- Publication date Sep 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND DEVICE FOR CUTTING SEMICONDUCTOR WAFERS
- Publication number 20130244403
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Forming Low Stress Joints Using Thermal Compress Bonding
- Publication number 20130128486
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Assembly Cleaning Process Using Vaporized Solvent
- Publication number 20130048027
- Publication date Feb 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- B08 - CLEANING
Information Patent Application
Forming Low Stress Joints Using Thermal Compress Bonding
- Publication number 20120021183
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Design for LPT arm cover
- Publication number 20050095976
- Publication date May 5, 2005
- Taiwan Semiconductor Manufacturing Co.
- Huan-Liang Tzeng
- H01 - BASIC ELECTRIC ELEMENTS

Lin-Wei Wang

Person

Patents Grantslast 30 patents

Apparatus for separating wafer from carrier

Innovative multi-purpose dipping plate

Method and device for cutting semiconductor wafers

Apparatus and method of separating wafer from carrier

Package assembly cleaning process using vaporized solvent

Forming low stress joints using thermal compress bonding

Forming low stress joints using thermal compress bonding

Patents Applicationslast 30 patents

APPARATUS FOR SEPARATING WAFER FROM CARRIER

Innovative Multi-Purpose Dipping Plate

Apparatus and Method for the Singulation of a Semiconductor Wafer

APPARATUS AND METHOD OF SEPARATING WAFER FROM CARRIER

METHOD AND DEVICE FOR CUTTING SEMICONDUCTOR WAFERS

Forming Low Stress Joints Using Thermal Compress Bonding

Package Assembly Cleaning Process Using Vaporized Solvent

Forming Low Stress Joints Using Thermal Compress Bonding

Design for LPT arm cover