Lin-Yin Wong

Person

Hsin-chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked package module and board having exposed ends
- Patent number 7,968,991
- Issue date Jun 28, 2011
- Unimicron Technology Corp.
- Lin-Yin Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip carrier structure having semiconductor chip embedded therein a...
- Patent number 7,880,296
- Issue date Feb 1, 2011
- Unimicron Technology Corp.
- Lin-Yin Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having heat-dissipating structure
- Patent number 7,656,015
- Issue date Feb 2, 2010
- Phoenix Precision Technology Corporation
- Lin-Yin Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structure of carrier boards embedded with semiconductor compo...
- Patent number 7,507,915
- Issue date Mar 24, 2009
- Phoenix Precision Technology Corporation
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrate having bonding pads with plated lay...
- Patent number 7,396,753
- Issue date Jul 8, 2008
- Phoenix Precision Technology Corporation
- Chih-Liang Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrate with embedded resistors and method...
- Patent number 7,323,762
- Issue date Jan 29, 2008
- Phoenix Precision Technology Corporation
- Zao-Kuo Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrate with embedded resistors and method...
- Patent number 7,135,377
- Issue date Nov 14, 2006
- Phoenix Precision Technology Corporation
- Zao-Kuo Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink structure with embedded electronic components for semicon...
- Patent number 7,050,304
- Issue date May 23, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging substrate having heat-dissipating structure
- Publication number 20090072384
- Publication date Mar 19, 2009
- Phoenix Precision Technology Corporation
- Lin-Yin Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package module
- Publication number 20080246135
- Publication date Oct 9, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Lin-Yin Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked package module
- Publication number 20080230886
- Publication date Sep 25, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Lin-Yin Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP CARRIER STRUCTURE HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN A...
- Publication number 20080217762
- Publication date Sep 11, 2008
- Phoenix Precision Technology Corporation
- Lin-Yin Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK STRUCTURE OF CARRIER BOARDS EMBEDDED WITH SEMICONDUCTOR COMPO...
- Publication number 20070084628
- Publication date Apr 19, 2007
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTIOR PACKAGE SUBSTRATE WITH EMBEDDED RESISTORS AND METHOD...
- Publication number 20060261462
- Publication date Nov 23, 2006
- Phoenix Precision Technology Corporation
- Zao-Kuo Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package substrate with embedded resistors and method...
- Publication number 20060094156
- Publication date May 4, 2006
- Phoenix Precision Technology Corporation
- Zao-Kuo Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package substrate having bonding pads with plated lay...
- Publication number 20060006422
- Publication date Jan 12, 2006
- Chih-Liang Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat sink structure with embedded electronic components for semicon...
- Publication number 20050047094
- Publication date Mar 3, 2005
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package substrate having bonding pads with plated lay...
- Publication number 20040099961
- Publication date May 27, 2004
- Chih-Liang Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lin-Yin Wong

Person

Patents Grantslast 30 patents

Stacked package module and board having exposed ends

Chip carrier structure having semiconductor chip embedded therein a...

Packaging substrate having heat-dissipating structure

Stack structure of carrier boards embedded with semiconductor compo...

Semiconductor package substrate having bonding pads with plated lay...

Semiconductor package substrate with embedded resistors and method...

Semiconductor package substrate with embedded resistors and method...

Heat sink structure with embedded electronic components for semicon...

Patents Applicationslast 30 patents

Packaging substrate having heat-dissipating structure

Stacked package module

Stacked package module

CHIP CARRIER STRUCTURE HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN A...

STACK STRUCTURE OF CARRIER BOARDS EMBEDDED WITH SEMICONDUCTOR COMPO...

SEMICONDUCTIOR PACKAGE SUBSTRATE WITH EMBEDDED RESISTORS AND METHOD...

Semiconductor package substrate with embedded resistors and method...

Semiconductor package substrate having bonding pads with plated lay...

Heat sink structure with embedded electronic components for semicon...

Semiconductor package substrate having bonding pads with plated lay...