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Lin Yu-Ting
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Hsin-Chu City, TW
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Patents Grants
last 30 patents
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Patent Grant
Bump pattern design for flip chip semiconductor package
Patent number
7,446,398
Issue date
Nov 4, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Pao-Kang Niu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
BUMP PATTERN DESIGN FOR FLIP CHIP SEMICONDUCTOR PACKAGE
Publication number
20080029876
Publication date
Feb 7, 2008
Taiwan Semiconductor Manufacturing Co., LTD
Pao-Kang Niu
H01 - BASIC ELECTRIC ELEMENTS