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last 30 patents
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Patent Grant
Method for manufacturing semiconductor apparatus
Patent number
10,381,398
Issue date
Aug 13, 2019
SEMICONDUCTOR MANUFACTURING INTL. (SHANGHAI) Corp.
Linbo Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad structure, bonding ring structure, and MEMS device pack...
Patent number
10,134,698
Issue date
Nov 20, 2018
Semiconductor Manufacturing International (Beijing) Corporation
Fucheng Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
Publication number
20190074323
Publication date
Mar 7, 2019
Semiconductor Manufacturing International (Shanghai) Corporation
Linbo Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...
Publication number
20170084557
Publication date
Mar 23, 2017
Semiconductor Manufacturing International (Beijing) Corporation
FUCHENG CHEN
B81 - MICRO-STRUCTURAL TECHNOLOGY