Linda Zhang

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for solder for through-mold interconnect
- Patent number 9,666,549
- Issue date May 30, 2017
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall solders for through-mold interconnect
- Patent number 9,159,690
- Issue date Oct 13, 2015
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TALL SOLDERS FOR THROUGH-MOLD INTERCONNECT
- Publication number 20160043049
- Publication date Feb 11, 2016
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL SOLDERS FOR THROUGH-MOLD INTERCONNECT
- Publication number 20150084192
- Publication date Mar 26, 2015
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS