Ling-Chen Kung

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming wafer level package
- Patent number 6,539,624
- Issue date Apr 1, 2003
- Industrial Technology Research Institute
- Ling-Chen Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bumps on flip chips and devices formed
- Patent number 6,440,836
- Issue date Aug 27, 2002
- Industrial Technology Research Institute
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method and packages formed
- Patent number 6,277,669
- Issue date Aug 21, 2001
- Industrial Technology Research Institute
- Ling-Chen Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fine-pitched solder bumps
- Patent number 6,268,114
- Issue date Jul 31, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method and devices formed
- Patent number 6,197,613
- Issue date Mar 6, 2001
- Industrial Technology Research Institute
- Ling-Chen Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bumps of improved height and devices formed
- Patent number 6,179,200
- Issue date Jan 30, 2001
- Industrial Technology Research Institute
- Ling-Chen Kung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR