Ling Mei LIN

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 9,768,132
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling Mei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with footing region
- Patent number 9,627,318
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ling Mei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING HIGH VOLTAGE TRANSISTOR AND STRUCTURE RESULTING T...
- Publication number 20240234566
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- LING MEI LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH FOOTING REGION
- Publication number 20150364420
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- LING MEI LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20130241064
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling Mei LIN
- H01 - BASIC ELECTRIC ELEMENTS