Ling-Wei Li

Follow

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and formation method of chip package with fan-out feature
- Patent number 11,784,091
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,456,276
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump layout for coplanarity improvement
- Patent number 11,211,318
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure including ring-like structure and method for...
- Patent number 11,088,108
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,770,427
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT FEATURE
- Publication number 20210066125
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH THROUGH VIAS
- Publication number 20210066179
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20200411468
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200411467
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP LAYOUT FOR COPLANARITY IMPROVEMENT
- Publication number 20200105654
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei Li
- G06 - COMPUTING CALCULATING COUNTING