Ling Xie

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Electrical connection structure and method of forming the same
- Patent number 11,508,619
- Issue date Nov 22, 2022
- Agency for Science, Technology and Research
- Hongyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a chip to a wafer
- Patent number 10,249,593
- Issue date Apr 2, 2019
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer arrangement and a wafer level package comprising the layer ar...
- Patent number 9,240,362
- Issue date Jan 19, 2016
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200411379
- Publication date Dec 31, 2020
- Agency for Science, Technology and Research
- Hongyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE
- Publication number 20170309584
- Publication date Oct 26, 2017
- Agency for Science, Technology and Research
- Ling Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD FOR BONDING A CHIP TO A WAFER
- Publication number 20170084570
- Publication date Mar 23, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER AR...
- Publication number 20150130039
- Publication date May 14, 2015
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Forming a Bonded Structure
- Publication number 20130037603
- Publication date Feb 14, 2013
- AGENCY FOR SCIENCE ,TECHNOLOGY AND RESEARCH
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS