Ling Zheng

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Packed interconnect structure with reduced cross coupled noise
- Patent number 10,950,536
- Issue date Mar 16, 2021
- Intel Corporation
- Zhen Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous interconnect having linear and non-linear conductive...
- Patent number 10,157,822
- Issue date Dec 18, 2018
- Intel Corporation
- Zhen Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKED INTERCONNECT STRUCTURE WITH REDUCED CROSS COUPLED NOISE
- Publication number 20190043796
- Publication date Feb 7, 2019
- Intel Corporation
- Zhen ZHOU
- H01 - BASIC ELECTRIC ELEMENTS