Lingli Duan

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 11,761,107
- Issue date Sep 19, 2023
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Reaction products of amine monomers and polymers containing saturat...
- Patent number 11,732,374
- Issue date Aug 22, 2023
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal plating compositions
- Patent number 10,892,802
- Issue date Jan 12, 2021
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal plating compositions
- Patent number 10,738,039
- Issue date Aug 11, 2020
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 10,738,388
- Issue date Aug 11, 2020
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electroplating baths containing reaction products of aminex,...
- Patent number 10,662,541
- Issue date May 26, 2020
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reaction products of amine monomers and polymers containing saturat...
- Patent number 10,604,856
- Issue date Mar 31, 2020
- Rohm and Haas Electronics Materials LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 10,604,858
- Issue date Mar 31, 2020
- Dow Global Technologies LLC
- Weijing Lu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 10,590,556
- Issue date Mar 17, 2020
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal plating compositions
- Patent number 10,435,380
- Issue date Oct 8, 2019
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Nitrogen containing polymers as levelers
- Patent number 10,196,751
- Issue date Feb 5, 2019
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Polymers containing benzimidazole moieties as levelers
- Patent number 10,201,097
- Issue date Feb 5, 2019
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal plating compositions
- Patent number 10,106,512
- Issue date Oct 23, 2018
- Dow Global Technologies LLC
- Lingli Duan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES,...
- Publication number 20210205052
- Publication date Jul 8, 2021
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES,...
- Publication number 20200179087
- Publication date Jun 11, 2020
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
REACTION PRODUCTS OF AMINE MONOMERS AND POLYMERS CONTAINING SATURAT...
- Publication number 20200149175
- Publication date May 14, 2020
- DOW GLOBAL TECHNOLOGIES LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...
- Publication number 20200149176
- Publication date May 14, 2020
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NEW METAL PLATING COMPOSITIONS
- Publication number 20200031818
- Publication date Jan 30, 2020
- DOW GLOBAL TECHNOLOGIES LLC
- LINGLI DUAN
- C07 - ORGANIC CHEMISTRY
Information Patent Application
NEW METAL PLATING COMPOSITIONS
- Publication number 20190100499
- Publication date Apr 4, 2019
- DOW GLOBAL TECHNOLOGIES LLC
- Lingli DUAN
- C07 - ORGANIC CHEMISTRY
Information Patent Application
GOLD PLATING SOLUTION
- Publication number 20180327908
- Publication date Nov 15, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Lingli DUAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINEX,...
- Publication number 20180245228
- Publication date Aug 30, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...
- Publication number 20180237931
- Publication date Aug 23, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...
- Publication number 20180237930
- Publication date Aug 23, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...
- Publication number 20180237929
- Publication date Aug 23, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REACTION PRODUCTS OF AMINE MONOMERS AND POLYMERS CONTAINING SATURAT...
- Publication number 20180135194
- Publication date May 17, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Lingli DUAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NEW METAL PLATING COMPOSITINOS
- Publication number 20180093957
- Publication date Apr 5, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- LINGLI DUAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NEW METAL PLATING COMPOSITIONS
- Publication number 20180051014
- Publication date Feb 22, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POLYMERS CONTAINING BENZIMIDAZOLE MOIETIES AS LEVELERS
- Publication number 20160255729
- Publication date Sep 1, 2016
- Rohm and Haas Electronic Materials L.L.C.
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NITROGEN CONTAINING POLYMERS AS LEVELERS
- Publication number 20160237579
- Publication date Aug 18, 2016
- Rohm and Haas Electronic Materials L.L.C.
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Lingli Duan

Person

Patents Grantslast 30 patents

Copper electroplating baths containing compounds of reaction produc...

Reaction products of amine monomers and polymers containing saturat...

Metal plating compositions

Metal plating compositions

Copper electroplating baths containing compounds of reaction produc...

Copper electroplating baths containing reaction products of aminex,...

Reaction products of amine monomers and polymers containing saturat...

Copper electroplating baths containing compounds of reaction produc...

Copper electroplating baths containing compounds of reaction produc...

Metal plating compositions

Nitrogen containing polymers as levelers

Polymers containing benzimidazole moieties as levelers

Metal plating compositions

Patents Applicationslast 30 patents

COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES,...

COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES,...

REACTION PRODUCTS OF AMINE MONOMERS AND POLYMERS CONTAINING SATURAT...

COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...

NEW METAL PLATING COMPOSITIONS

NEW METAL PLATING COMPOSITIONS

GOLD PLATING SOLUTION

COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINEX,...

COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...

COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...

COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...

REACTION PRODUCTS OF AMINE MONOMERS AND POLYMERS CONTAINING SATURAT...

NEW METAL PLATING COMPOSITINOS

NEW METAL PLATING COMPOSITIONS

POLYMERS CONTAINING BENZIMIDAZOLE MOIETIES AS LEVELERS

NITROGEN CONTAINING POLYMERS AS LEVELERS