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Shrewsbury, MA, US
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last 30 patents
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Patent Application
METHOD OF ELECTROPLATING LOW INTERNAL STRESS COPPER DEPOSITS ON THI...
Publication number
20170145577
Publication date
May 25, 2017
Rohm and Haas Electronic Materials L.L.C.
Yu Hua Kao
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW I...
Publication number
20170067173
Publication date
Mar 9, 2017
Rohm and Haas Electronic Materials L.L.C.
Lingyun Wei
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW I...
Publication number
20160312372
Publication date
Oct 27, 2016
Rohm and Haas Electronic Materials L.L.C.
Lingyun WEI
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING OF COPPER ON SEMICONDUCTORS
Publication number
20140174936
Publication date
Jun 26, 2014
Rohm and Haas Electronic Materials L.L.C.
Gary Hamm
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD OF METAL PLATING SEMICONDUCTORS
Publication number
20140008234
Publication date
Jan 9, 2014
Rohm and Haas Electronic Materials L.L.C.
Lingyun WEI
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ACTIVATION PROCESS TO IMPROVE METAL ADHESION
Publication number
20130203252
Publication date
Aug 8, 2013
Rohm and Haas Electronic Materials L.L.C.
Lingyun WEI
H01 - BASIC ELECTRIC ELEMENTS