Linlin Wang

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film treatment process
- Patent number 10,971,357
- Issue date Apr 6, 2021
- Applied Materials, Inc.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorination during ALD high-k, fluorination post high-k and use of...
- Patent number 10,580,643
- Issue date Mar 3, 2020
- Applied Materials, Inc.
- Johanes S. Swenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HKMG integration
- Patent number 10,504,746
- Issue date Dec 10, 2019
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet oxidation process performed on a dielectric material formed fro...
- Patent number 9,390,914
- Issue date Jul 12, 2016
- Applied Materials, Inc.
- Linlin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for reduced outgassing
- Patent number 8,466,073
- Issue date Jun 18, 2013
- Applied Materials, Inc.
- Linlin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ ozone cure for radical-component CVD
- Patent number 8,304,351
- Issue date Nov 6, 2012
- Applied Materials, Inc.
- Linlin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon-selective dry etch for carbon-containing films
- Patent number 8,211,808
- Issue date Jul 3, 2012
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for improving dielectric film quality for void fr...
- Patent number 7,541,297
- Issue date Jun 2, 2009
- Applied Materials, Inc.
- Abhijit Basu Mallick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PROCESS CHAMBER PROCESS KIT WITH PROTECTIVE COATING
- Publication number 20230245863
- Publication date Aug 3, 2023
- Applied Materials, Inc.
- Jian WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN FILM TREATMENT PROCESS
- Publication number 20200111659
- Publication date Apr 9, 2020
- Applied Materials, Inc.
- Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CHAMBER PROCESS KIT WITH PROTECTIVE COATING
- Publication number 20190385825
- Publication date Dec 19, 2019
- Applied Materials, Inc.
- Jian WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PERFORMING DECOUPLED PLASMA FLUORINATION TO REDUCE INTERFACIAL DEFE...
- Publication number 20180033619
- Publication date Feb 1, 2018
- Applied Materials, Inc.
- Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HKMG INTEGRATION
- Publication number 20170294320
- Publication date Oct 12, 2017
- Applied Materials, Inc.
- Zhenjiang CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINATION DURING ALD HIGH-K, FLUORINATION POST HIGH-K AND USE OF...
- Publication number 20170236702
- Publication date Aug 17, 2017
- Applied Materials, Inc.
- Johanes S. SWENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS FOR DECREASING ETCH RATES AFTER FLOWABLE DEPOSITION OF S...
- Publication number 20130217241
- Publication date Aug 22, 2013
- Applied Materials, Inc.
- Brian S. Underwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOWABLE SILICON-CARBON-NITROGEN LAYERS FOR SEMICONDUCTOR PROCESSING
- Publication number 20130217240
- Publication date Aug 22, 2013
- Applied Materials, Inc.
- Abhijit Basu Mallick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPPING LAYER FOR REDUCED OUTGASSING
- Publication number 20120309205
- Publication date Dec 6, 2012
- Applied Materials, Inc.
- Linlin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WET OXIDATION PROCESS PERFORMED ON A DIELECTRIC MATERIAL FORMED FRO...
- Publication number 20120142198
- Publication date Jun 7, 2012
- Applied Materials, Inc.
- Linlin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU OZONE CURE FOR RADICAL-COMPONENT CVD
- Publication number 20120003840
- Publication date Jan 5, 2012
- Applied Materials Inc.
- Linlin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WET OXIDATION PROCESS PERFORMED ON A DIELECTRIC MATERIAL FORMED FRO...
- Publication number 20110151677
- Publication date Jun 23, 2011
- APPLIED MATERIALS, INC.
- Linlin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-SELECTIVE DRY ETCH FOR CARBON-CONTAINING FILMS
- Publication number 20110053380
- Publication date Mar 3, 2011
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR IMPROVING DIELECTRIC FILM QUALITY FOR VOID FR...
- Publication number 20090104789
- Publication date Apr 23, 2009
- Applied Materials, Inc.
- Abhijit Basu Mallick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Linlin Wang

Person

Patents Grantslast 30 patents

Thin film treatment process

Fluorination during ALD high-k, fluorination post high-k and use of...

HKMG integration

Wet oxidation process performed on a dielectric material formed fro...

Capping layer for reduced outgassing

In-situ ozone cure for radical-component CVD

Silicon-selective dry etch for carbon-containing films

Method and system for improving dielectric film quality for void fr...

Patents Applicationslast 30 patents

PROCESS CHAMBER PROCESS KIT WITH PROTECTIVE COATING

THIN FILM TREATMENT PROCESS

PROCESS CHAMBER PROCESS KIT WITH PROTECTIVE COATING

PERFORMING DECOUPLED PLASMA FLUORINATION TO REDUCE INTERFACIAL DEFE...

HKMG INTEGRATION

FLUORINATION DURING ALD HIGH-K, FLUORINATION POST HIGH-K AND USE OF...

TREATMENTS FOR DECREASING ETCH RATES AFTER FLOWABLE DEPOSITION OF S...

FLOWABLE SILICON-CARBON-NITROGEN LAYERS FOR SEMICONDUCTOR PROCESSING

CAPPING LAYER FOR REDUCED OUTGASSING

WET OXIDATION PROCESS PERFORMED ON A DIELECTRIC MATERIAL FORMED FRO...

IN-SITU OZONE CURE FOR RADICAL-COMPONENT CVD

WET OXIDATION PROCESS PERFORMED ON A DIELECTRIC MATERIAL FORMED FRO...

SILICON-SELECTIVE DRY ETCH FOR CARBON-CONTAINING FILMS

METHOD AND SYSTEM FOR IMPROVING DIELECTRIC FILM QUALITY FOR VOID FR...