Linn Garrison

Person

Garland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for holding a strip of conductive lead frames
- Patent number 5,182,851
- Issue date Feb 2, 1993
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal leadframe carrier
- Patent number 5,111,935
- Issue date May 12, 1992
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform leadframe carrier
- Patent number 4,815,595
- Issue date Mar 28, 1989
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for flash-free insert molding and method therefor
- Patent number 4,778,146
- Issue date Oct 18, 1988
- ASM Fico
- Mike Olla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip selection in automatic assembly of integrated circuit
- Patent number 4,759,675
- Issue date Jul 26, 1988
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset bending of curvaceously planar radiating leadframe leads in...
- Patent number 4,743,956
- Issue date May 10, 1988
- Thomson Components-Moster Corporation
- Michael A. Olla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated-circuit leadframe adapted for a simultaneous bonding ope...
- Patent number 4,722,060
- Issue date Jan 26, 1988
- Thomson Components-Mostek Corporation
- Daniel J. Quinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip selection in automatic assembly of integrated circuit
- Patent number 4,627,787
- Issue date Dec 9, 1986
- Thomson Components-Mostek Corporation
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS

Linn Garrison

Person

Patents Grantslast 30 patents

Method for holding a strip of conductive lead frames

Universal leadframe carrier

Uniform leadframe carrier

Leadframe for flash-free insert molding and method therefor

Chip selection in automatic assembly of integrated circuit

Offset bending of curvaceously planar radiating leadframe leads in...

Integrated-circuit leadframe adapted for a simultaneous bonding ope...

Chip selection in automatic assembly of integrated circuit