LINPING LI

Person

Hangzhou City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Cavity structure of bulk acoustic resonator, and manufacturing process
- Patent number 12,166,469
- Issue date Dec 10, 2024
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
- Linping Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Manufacturing process for bulk acoustic resonator, and bulk acousti...
- Patent number 12,113,503
- Issue date Oct 8, 2024
- HANGZHOU XINGHE TECHNOLOGY CO., LTD.
- Linping Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic resonator with reinforcing structure and manufacturing met...
- Patent number 11,973,484
- Issue date Apr 30, 2024
- HANGZHOU XINGHE TECHNOLOGY CO., LTD.
- Linping Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thin film bulk acoustic resonator and manufacturing process therefor
- Patent number 11,901,872
- Issue date Feb 13, 2024
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
- Linping Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic resonator assembly and filter
- Patent number 11,881,839
- Issue date Jan 23, 2024
- HANGZHOU XINGHE TECHNOLOGY CO., LTD.
- Linping Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
EMI shielding material, EMI shielding process, and communication mo...
- Patent number 11,770,920
- Issue date Sep 26, 2023
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bulk acoustic resonator with heat dissipation structure and fabrica...
- Patent number 11,742,824
- Issue date Aug 29, 2023
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
- Linping Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solidly mounted resonator having electromagnetic shielding structur...
- Patent number 11,695,386
- Issue date Jul 4, 2023
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
- Linping Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip packaging method and chip packaging structure
- Patent number 11,552,028
- Issue date Jan 10, 2023
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging a chip
- Patent number 11,177,141
- Issue date Nov 16, 2021
- JWL (Zhejiang) Semiconductor Co., Ltd
- Linping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip packaging structure
- Patent number 10,985,120
- Issue date Apr 20, 2021
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
- Linping Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESONATOR, FILTER, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING...
- Publication number 20240372527
- Publication date Nov 7, 2024
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC RESONATOR, RESONATOR ASSEMBLY, FILTER, AND ELECTRONIC...
- Publication number 20240275358
- Publication date Aug 15, 2024
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC RESONATOR AND MANUFACTURING METHOD THEREOF, FILTER AN...
- Publication number 20240267019
- Publication date Aug 8, 2024
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MANUFACTURING PROCESS FOR BULK ACOUSTIC RESONATOR, AND BULK A...
- Publication number 20230327627
- Publication date Oct 12, 2023
- HANGZHOU XINGHE TECHNOLOGY CO., LTD.
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC RESONATOR ASSEMBLY AND FILTER
- Publication number 20230327643
- Publication date Oct 12, 2023
- HANGZHOU XINGHE TECHNOLOGY CO., LTD.
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CAVITY STRUCTURE OF BULK ACOUSTIC RESONATOR, AND MANUFACTURING PROCESS
- Publication number 20230238933
- Publication date Jul 27, 2023
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC RESONATOR WITH REINFORCING STRUCTURE AND MANUFACTURING MET...
- Publication number 20230216472
- Publication date Jul 6, 2023
- HANGZHOU XINGHE TECHNOLOGY CO., LTD.
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THIN FILM BULK ACOUSTIC RESONATOR AND MANUFACTURING PROCESS THEREFOR
- Publication number 20230208383
- Publication date Jun 29, 2023
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC RESONATOR WITH HEAT DISSIPATION STRUCTURE AND FABRICA...
- Publication number 20230076029
- Publication date Mar 9, 2023
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SOLIDLY MOUNTED RESONATOR HAVING ELECTROMAGNETIC SHIELDING STRUCTUR...
- Publication number 20230063980
- Publication date Mar 2, 2023
- JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD
- Linping LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
EMI SHIELDING MATERIAL, EMI SHIELDING PROCESS, AND COMMUNICATION MO...
- Publication number 20220418174
- Publication date Dec 29, 2022
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20220181269
- Publication date Jun 9, 2022
- HUZHOU JIANWENLU TECHNOLOGY CO., LTD.
- Linping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20210111135
- Publication date Apr 15, 2021
- HANGZHOU JWL TECHNOLOGY INC.
- Linping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING A CHIP AND A CHIP PACKAGE STRUCTURE THEREOF
- Publication number 20200343109
- Publication date Oct 29, 2020
- Hangzhou JWL Technology Inc.
- LINPING LI
- H03 - BASIC ELECTRONIC CIRCUITRY

Person

Patents Grantslast 30 patents

Cavity structure of bulk acoustic resonator, and manufacturing process

Manufacturing process for bulk acoustic resonator, and bulk acousti...

Acoustic resonator with reinforcing structure and manufacturing met...

Thin film bulk acoustic resonator and manufacturing process therefor

Acoustic resonator assembly and filter

EMI shielding material, EMI shielding process, and communication mo...

Bulk acoustic resonator with heat dissipation structure and fabrica...

Solidly mounted resonator having electromagnetic shielding structur...

Chip packaging method and chip packaging structure

Method for packaging a chip

Chip packaging method and chip packaging structure

Patents Applicationslast 30 patents

RESONATOR, FILTER, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING...

BULK ACOUSTIC RESONATOR, RESONATOR ASSEMBLY, FILTER, AND ELECTRONIC...

BULK ACOUSTIC RESONATOR AND MANUFACTURING METHOD THEREOF, FILTER AN...

MANUFACTURING PROCESS FOR BULK ACOUSTIC RESONATOR, AND BULK A...

ACOUSTIC RESONATOR ASSEMBLY AND FILTER

CAVITY STRUCTURE OF BULK ACOUSTIC RESONATOR, AND MANUFACTURING PROCESS

ACOUSTIC RESONATOR WITH REINFORCING STRUCTURE AND MANUFACTURING MET...

THIN FILM BULK ACOUSTIC RESONATOR AND MANUFACTURING PROCESS THEREFOR

BULK ACOUSTIC RESONATOR WITH HEAT DISSIPATION STRUCTURE AND FABRICA...

SOLIDLY MOUNTED RESONATOR HAVING ELECTROMAGNETIC SHIELDING STRUCTUR...

EMI SHIELDING MATERIAL, EMI SHIELDING PROCESS, AND COMMUNICATION MO...

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

METHOD FOR PACKAGING A CHIP AND A CHIP PACKAGE STRUCTURE THEREOF