Liop-Jin Yap

Person

Singappore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-package conversion kit for a pick and place handler
- Patent number 7,076,861
- Issue date Jul 18, 2006
- St Assembly Test Services Pte.
- Kai Wah Sum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Testing of BGA and other CSP packages using probing techniques
- Patent number 6,791,346
- Issue date Sep 14, 2004
- ST Assembly Test Services PTE LTD
- Rajiv Mehta
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for establishing quick and reliable connection...
- Patent number 6,586,925
- Issue date Jul 1, 2003
- ST Assembly Test Services Ltd.
- Ramamoorthi Ramesh
- G01 - MEASURING TESTING
Information Patent Grant
Testing of BGA and other CSP packages using probing techniques
- Patent number 6,535,004
- Issue date Mar 18, 2003
- ST Assembly Test Service Ltd.
- Rajiv Mehta
- G01 - MEASURING TESTING
Information Patent Grant
BGA device positioner kit
- Patent number 6,433,564
- Issue date Aug 13, 2002
- St Assemby Test Services Pte. Ltd
- B. S. Chandra Shekar
- G01 - MEASURING TESTING
Information Patent Grant
Testing of BGA and other CSP packages using probing techniques
- Patent number 6,404,212
- Issue date Jun 11, 2002
- ST Assembly Test Services PTE LTD
- Rajiv Mehta
- G01 - MEASURING TESTING
Information Patent Grant
Reliable method and apparatus for interfacing between a ball grid a...
- Patent number 6,300,781
- Issue date Oct 9, 2001
- ST Assembly Test Services PTE LTD
- Liop Jin Yap
- G01 - MEASURING TESTING
Information Patent Grant
Device probe socket forming part of a test head, interfacing betwee...
- Patent number 6,242,933
- Issue date Jun 5, 2001
- ST Assembly Test Services
- Liop-Jin Yap
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Multi-package conversion kit for a pick and place handler
- Publication number 20040134054
- Publication date Jul 15, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Kai Wah Sum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Robust universal docking system
- Publication number 20020145438
- Publication date Oct 10, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Ramamoorthi Ramesh
- G01 - MEASURING TESTING
Information Patent Application
Testing of BGA and other CSP packages using probing techniques
- Publication number 20020125909
- Publication date Sep 12, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Rajiv Mehta
- G01 - MEASURING TESTING
Information Patent Application
Testing of BGA and other CSP packages using probing techniques
- Publication number 20020125908
- Publication date Sep 12, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Rajiv Mehta
- G01 - MEASURING TESTING

Liop-Jin Yap

Person

Patents Grantslast 30 patents

Multi-package conversion kit for a pick and place handler

Testing of BGA and other CSP packages using probing techniques

Method and apparatus for establishing quick and reliable connection...

Testing of BGA and other CSP packages using probing techniques

BGA device positioner kit

Testing of BGA and other CSP packages using probing techniques

Reliable method and apparatus for interfacing between a ball grid a...

Device probe socket forming part of a test head, interfacing betwee...

Patents Applicationslast 30 patents

Multi-package conversion kit for a pick and place handler

Robust universal docking system

Testing of BGA and other CSP packages using probing techniques

Testing of BGA and other CSP packages using probing techniques