Liping Guo

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having lead frame with notched inner leads
- Patent number 9,299,645
- Issue date Mar 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective packaging for integrated circuit device
- Patent number 9,196,557
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jianshe Bi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE PACKAGING FOR INTEGRATED CIRCUIT DEVICE
- Publication number 20150332985
- Publication date Nov 19, 2015
- Jianshe Bi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LEAD FRAME WITH NOTCHED INNER LEADS
- Publication number 20150279765
- Publication date Oct 1, 2015
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH RECESSED DIE BOND AREA
- Publication number 20110241187
- Publication date Oct 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Liping Guo
- H01 - BASIC ELECTRIC ELEMENTS