Lipu Kris Chuang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package and method
- Patent number 11,984,372
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Teng-Yuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 11,830,866
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,749,640
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 11,551,999
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,450,581
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Teng-Yuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package including thermal con...
- Patent number 11,309,302
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,205,636
- Issue date Dec 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module, semiconductor package including the same, and manufa...
- Patent number 11,018,113
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,811,384
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including thermal relaxation block and manufa...
- Patent number 10,720,416
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,672,681
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor package and method of manufacturing the same
- Patent number 10,510,713
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 10,256,203
- Issue date Apr 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240274483
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Teng-Yuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
- Publication number 20230378151
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230361078
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230343764
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Staggered Metal Mesh on Backside of Device Die and Method Forming Same
- Publication number 20230154764
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20220367301
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Teng-Yuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220359347
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220238505
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220102314
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20220068736
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Teng-Yuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210202354
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MANUFA...
- Publication number 20210118847
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210013177
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200303364
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135692
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200058632
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190333836
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR DEVICE AND SEMICONDCUTOR PACKAGE
- Publication number 20190035752
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Lipu Kris Chuang

Person

Patents Grantslast 30 patents

Integrated circuit package and method

Semiconductor package with thermal relaxation block and manufacturi...

Semiconductor package and method of manufacturing the same

Memory device and manufacturing method thereof

Integrated circuit package and method

Manufacturing method of semiconductor package including thermal con...

Semiconductor package and method of manufacturing the same

Memory module, semiconductor package including the same, and manufa...

Semiconductor package and method of manufacturing the same

Semiconductor package including thermal relaxation block and manufa...

Semiconductor packages

Semicondcutor package and method of manufacturing the same

Semiconductor device and semiconductor package

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

Staggered Metal Mesh on Backside of Device Die and Method Forming Same

INTEGRATED CIRCUIT PACKAGE AND METHOD

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

MEMORY MODULE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MANUFA...

SEMICONDCUTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDCUTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES

SEMICONDCUTOR DEVICE AND SEMICONDCUTOR PACKAGE