Liqi WU

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual silicide process using ruthenium silicide
- Patent number 12,094,785
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Thomas Anthony Empante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selective deposition using self-assembled monolayers
- Patent number 12,024,770
- Issue date Jul 2, 2024
- Applied Materials, Inc.
- Chang Ke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of selective atomic layer deposition
- Patent number 11,821,085
- Issue date Nov 21, 2023
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer treatment for achieving defect-free self-assembled monolayers
- Patent number 11,735,420
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Chang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for enhancing selectivity in SAM-based selective deposition
- Patent number 11,515,155
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Chang Ke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective aluminum oxide film deposition
- Patent number 11,450,525
- Issue date Sep 20, 2022
- Applied Materials, Inc.
- Liqi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for high reflectivity aluminum layers
- Patent number 11,421,318
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Jacqueline Wrench
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for n-type metal oxide semiconductor (NMOS) m...
- Patent number 11,075,276
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cryogenic gas stream assisted SAM-based s...
- Patent number 11,033,930
- Issue date Jun 15, 2021
- Applied Materials, Inc.
- Chang Ke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a layer
- Patent number 10,957,590
- Issue date Mar 23, 2021
- Applied Materials, Inc.
- Wenhui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for enhancing selectivity in SAM-based selective deposition
- Patent number 10,950,433
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Chang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer treatment for achieving defect-free self-assembled monolayers
- Patent number 10,770,292
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Chang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition defects removal by chemical etch
- Patent number 10,643,840
- Issue date May 5, 2020
- Applied Materials, Inc.
- Jeffrey W. Anthis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thickness dependent work-function nMOS integration for metal gate
- Patent number 10,608,097
- Issue date Mar 31, 2020
- Applied Materials, Inc.
- Paul F. Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch of metal nitride films
- Patent number 10,014,185
- Issue date Jul 3, 2018
- Applied Materials, Inc.
- Liqi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-threshold voltage structures with a lanthanum nitride film an...
- Patent number 9,748,354
- Issue date Aug 29, 2017
- Applied Materials, Inc.
- Wei V. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming metal organic tungsten for middle of the line (...
- Patent number 9,653,352
- Issue date May 16, 2017
- Applied Materials, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Continuous plasma and RF bias to regulate damage in a substrate pro...
- Patent number 9,194,045
- Issue date Nov 24, 2015
- Novellus Systems, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density plasma etchback process for advanced metallization app...
- Patent number 8,431,033
- Issue date Apr 30, 2013
- Novellus Systems, Inc.
- Chunming Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES
- Publication number 20250006552
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Liqi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE MONOMER FOR SMOOTH POLYMER SURFACE
- Publication number 20250006555
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SILICIDE PROCESS USING RUTHENIUM SILICIDE
- Publication number 20240404888
- Publication date Dec 5, 2024
- Applied Materuals, Inc.
- Thomas Anthony Empante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW RESISTIVITY CONTACTS
- Publication number 20240379363
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Jianqiu GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A MEOL CONTACT STRUCTURE
- Publication number 20240379768
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shumao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE DAMAGE-FREE DRY ETCH METHOD FOR TUNGSTEN REMOVAL IN...
- Publication number 20240371654
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Qihao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-ENERGY UNDERLAYER FOR ROOM TEMPERATURE PHYSICAL VAPOR DEPOSITIO...
- Publication number 20240363407
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Jie ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVE DEPOSITION USING SELF-ASSEMBLED MONOLAYERS
- Publication number 20240352577
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- CHANG KE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods for Forming Low Resistivity Contacts
- Publication number 20240105444
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Jiang LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF SELECTIVE ATOMIC LAYER DEPOSITION
- Publication number 20240052487
- Publication date Feb 15, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL CAP FOR CONTACT RESISTANCE REDUCTION
- Publication number 20240038859
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER
- Publication number 20230386833
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...
- Publication number 20230343643
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD SUPPRESSED METAL GAPFILL
- Publication number 20230326744
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SILICIDE PROCESS USING RUTHENIUM SILICIDE
- Publication number 20230187282
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Thomas Anthony Empante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES
- Publication number 20220359279
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20220325410
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CAP FOR CONTACT RESISTANCE REDUCTION
- Publication number 20220231137
- Publication date Jul 21, 2022
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ruthenium Reflow For Via Fill
- Publication number 20220223472
- Publication date Jul 14, 2022
- Applied Materials, Inc.
- Yi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Cryogenic Gas Stream Assisted SAM-based S...
- Publication number 20210283650
- Publication date Sep 16, 2021
- Applied Materials, Inc.
- Chang Ke
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20210285102
- Publication date Sep 16, 2021
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods For Enhancing Selectivity In Sam-Based Selective Deposition
- Publication number 20210217615
- Publication date Jul 15, 2021
- Applied Materials, Inc.
- Chang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Selective Atomic Layer Deposition
- Publication number 20210189562
- Publication date Jun 24, 2021
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods To Grow Low Resistivity Metal Containing Films
- Publication number 20210123136
- Publication date Apr 29, 2021
- Applied Materials, Inc.
- Lakmal C. Kalutarage
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER TREATMENT FOR ACHIEVING DEFECT-FREE SELF-ASSEMBLED MONOLAYERS
- Publication number 20200402792
- Publication date Dec 24, 2020
- Applied Materials, Inc.
- Chang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reverse Selective Deposition
- Publication number 20200347493
- Publication date Nov 5, 2020
- Applied Materials, Inc.
- FENG Q. LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANNEALING PROCESSES TO STABILIZE NICKEL-CONTAINING FILMS
- Publication number 20200335329
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Jeffery W. Anthis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A LAYER
- Publication number 20200161181
- Publication date May 21, 2020
- Applied Materials, Inc.
- Wenhui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR N-TYPE METAL OXIDE SEMICONDUCTOR (NMOS) M...
- Publication number 20200111885
- Publication date Apr 9, 2020
- Applied Materials, Inc.
- YONGJING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING NICKEL-CONTAINING FILMS
- Publication number 20200106012
- Publication date Apr 2, 2020
- Applied Materials, Inc.
- Hung Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Dual silicide process using ruthenium silicide

Methods for selective deposition using self-assembled monolayers

Methods of selective atomic layer deposition

Wafer treatment for achieving defect-free self-assembled monolayers

Methods for enhancing selectivity in SAM-based selective deposition

Selective aluminum oxide film deposition

Methods and apparatus for high reflectivity aluminum layers

Methods and apparatus for n-type metal oxide semiconductor (NMOS) m...

Methods and apparatus for cryogenic gas stream assisted SAM-based s...

Method for forming a layer

Methods for enhancing selectivity in SAM-based selective deposition

Wafer treatment for achieving defect-free self-assembled monolayers

Selective deposition defects removal by chemical etch

Low thickness dependent work-function nMOS integration for metal gate

Selective etch of metal nitride films

Multi-threshold voltage structures with a lanthanum nitride film an...

Methods for forming metal organic tungsten for middle of the line (...

Continuous plasma and RF bias to regulate damage in a substrate pro...

High density plasma etchback process for advanced metallization app...

Patents Applicationslast 30 patents

BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES

FLEXIBLE MONOMER FOR SMOOTH POLYMER SURFACE

DUAL SILICIDE PROCESS USING RUTHENIUM SILICIDE

METHODS FOR FORMING LOW RESISTIVITY CONTACTS

METHOD OF FORMING A MEOL CONTACT STRUCTURE

SILICON NITRIDE DAMAGE-FREE DRY ETCH METHOD FOR TUNGSTEN REMOVAL IN...

LOW-ENERGY UNDERLAYER FOR ROOM TEMPERATURE PHYSICAL VAPOR DEPOSITIO...

METHODS FOR SELECTIVE DEPOSITION USING SELF-ASSEMBLED MONOLAYERS

Methods for Forming Low Resistivity Contacts

METHODS OF SELECTIVE ATOMIC LAYER DEPOSITION

METAL CAP FOR CONTACT RESISTANCE REDUCTION

SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER

GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...

FIELD SUPPRESSED METAL GAPFILL

DUAL SILICIDE PROCESS USING RUTHENIUM SILICIDE

METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES

GAP FILL METHODS USING CATALYZED DEPOSITION

METAL CAP FOR CONTACT RESISTANCE REDUCTION

Ruthenium Reflow For Via Fill

Methods and Apparatus for Cryogenic Gas Stream Assisted SAM-based S...

GAP FILL METHODS USING CATALYZED DEPOSITION

Methods For Enhancing Selectivity In Sam-Based Selective Deposition

Methods Of Selective Atomic Layer Deposition

Methods To Grow Low Resistivity Metal Containing Films

WAFER TREATMENT FOR ACHIEVING DEFECT-FREE SELF-ASSEMBLED MONOLAYERS

Reverse Selective Deposition

ANNEALING PROCESSES TO STABILIZE NICKEL-CONTAINING FILMS

METHOD FOR FORMING A LAYER

METHODS AND APPARATUS FOR N-TYPE METAL OXIDE SEMICONDUCTOR (NMOS) M...

METHODS OF FORMING NICKEL-CONTAINING FILMS