Liqiang Cao

Person

Wuxi, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor cleaning equipment and method for cleaning through vi...
- Patent number 11,854,794
- Issue date Dec 26, 2023
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Daping Yao
- B08 - CLEANING
Information Patent Grant
Stress sensor structure and a manufacturing method thereof
- Patent number 11,067,459
- Issue date Jul 20, 2021
- NATIONAL CENTER FOR ADVANCED PACKAGE
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240203865
- Publication date Jun 20, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Quanlong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20240186200
- Publication date Jun 6, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...
- Publication number 20240071873
- Publication date Feb 29, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...
- Publication number 20230091513
- Publication date Mar 23, 2023
- SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR CHIP
- Publication number 20220115356
- Publication date Apr 14, 2022
- National Center for Advanced Packaging Co., Ltd.
- Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLEANING EQUIPMENT AND METHOD FOR CLEANING THROUGH VI...
- Publication number 20210296115
- Publication date Sep 23, 2021
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Daping YAO
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
A STRESS SENSOR STRUCTURE AND A MANUFACTURING METHOD THEREOF
- Publication number 20210223122
- Publication date Jul 22, 2021
- National Center for Advanced Packaging Co., Ltd.
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS

Liqiang Cao

Person

Patents Grantslast 30 patents

Semiconductor cleaning equipment and method for cleaning through vi...

Stress sensor structure and a manufacturing method thereof

Patents Applicationslast 30 patents

CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR

SENSING CHIP PACKAGING STRUCTURE AND METHOD

PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...

WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...

FAN-OUT ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR CHIP

SEMICONDUCTOR CLEANING EQUIPMENT AND METHOD FOR CLEANING THROUGH VI...

A STRESS SENSOR STRUCTURE AND A MANUFACTURING METHOD THEREOF