LIQIANG XU

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor devices having ribbon wires
- Patent number 9,570,325
- Issue date Feb 14, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Liqiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of assembling same
- Patent number 8,969,135
- Issue date Mar 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING RIBBON WIRES
- Publication number 20160190086
- Publication date Jun 30, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LIQIANG XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20140246767
- Publication date Sep 4, 2014
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS
- Publication number 20140103096
- Publication date Apr 17, 2014
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS