Liquan CAI

Follow

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing semiconductor wafers
- Patent number 12,131,924
- Issue date Oct 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser system for dicing semiconductor structure and operation metho...
- Patent number 12,121,995
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser dicing system and method for dicing semiconductor structure i...
- Patent number 12,106,985
- Issue date Oct 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...
- Publication number 20250010403
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...
- Publication number 20250010402
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER DICING SYSTEM AND METHOD FOR DICING SEMICONDUCTOR STRUCTURE
- Publication number 20220319888
- Publication date Oct 6, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Liquan CAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...
- Publication number 20220314369
- Publication date Oct 6, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROCESSING SEMICONDUCTOR WAFERS
- Publication number 20220157627
- Publication date May 19, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liquan CAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR