Lisa H. Karlin

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including accelerometer devices
- Patent number 9,233,836
- Issue date Jan 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity based packaging for MEMS devices
- Patent number 9,061,885
- Issue date Jun 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming an integrated circuit having varying substrate depth
- Patent number 8,921,203
- Issue date Dec 30, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Attaching a MEMS to a bonding wafer
- Patent number 8,652,865
- Issue date Feb 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a semiconductor device that limits damage to...
- Patent number 8,551,814
- Issue date Oct 8, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic flow containment in a semiconductor fabrication process
- Patent number 8,525,316
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device structures for in-plane and out-of-plane sensing micro-elect...
- Patent number 8,461,656
- Issue date Jun 11, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a micro-electro-mechanical-systems (MEMS) device
- Patent number 8,455,286
- Issue date Jun 4, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical coupling of wafer structures
- Patent number 8,138,062
- Issue date Mar 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a micro-electromechanical system (MEMS) having a...
- Patent number 8,119,431
- Issue date Feb 21, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming a capped micro-electro-mechanical system (MEMS)...
- Patent number 8,039,312
- Issue date Oct 18, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Veera M. Gunturu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing microelectromechanical device with isolated mic...
- Patent number 7,943,525
- Issue date May 17, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Lisa Z. Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic flow containment in a semiconductor fabrication process
- Patent number 7,846,815
- Issue date Dec 7, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT HAVING VARYING SUBSTRATE DEPTH AND METHOD OF FOR...
- Publication number 20150084138
- Publication date Mar 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE LEVEL ADJUSTMENT IN A CAVITY OF A SEMICONDUCTOR DIE
- Publication number 20140225206
- Publication date Aug 14, 2014
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20140008739
- Publication date Jan 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT HAVING VARYING SUBSTRATE DEPTH AND METHOD OF FOR...
- Publication number 20130285161
- Publication date Oct 31, 2013
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ATTACHING A MEMS TO A BONDING WAFER
- Publication number 20130043564
- Publication date Feb 21, 2013
- LISA H. KARLIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MAKING A MICRO-ELECTRO-MECHANICAL-SYSTEMS (MEMS) DEVICE
- Publication number 20120107993
- Publication date May 3, 2012
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PRODUCING LAYERED WAFER STRUCTURE HAVING ANTI-STICTION BUMPS
- Publication number 20120107992
- Publication date May 3, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR MAKING IN-PLANE AND OUT-OF-PLANE SENSING MICRO-ELECTRO-...
- Publication number 20120001277
- Publication date Jan 5, 2012
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20110221042
- Publication date Sep 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL COUPLING OF WAFER STRUCTURES
- Publication number 20110143476
- Publication date Jun 16, 2011
- LIANJUN LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTROMECHANICAL SYSTEMS (MEMS) HAVING A GAP STOP AND METHOD...
- Publication number 20110133294
- Publication date Jun 9, 2011
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EUTECTIC FLOW CONTAINMENT IN A SEMICONDUCTOR FABRICATION PROCESS
- Publication number 20110042761
- Publication date Feb 24, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EUTECTIC FLOW CONTAINMENT IN A SEMICONDUCTOR FABRICATION PROCESS
- Publication number 20100244159
- Publication date Sep 30, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Fabricating High Aspect Ratio Transducer Using Metal Comp...
- Publication number 20100193884
- Publication date Aug 5, 2010
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH ISOLATED MICROSTRUCTURES AND MET...
- Publication number 20100155861
- Publication date Jun 24, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Lisa Z. Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Lisa H. Karlin

Person

Patents Grantslast 30 patents

Semiconductor device including accelerometer devices

Cavity based packaging for MEMS devices

Method of forming an integrated circuit having varying substrate depth

Attaching a MEMS to a bonding wafer

Method of fabricating a semiconductor device that limits damage to...

Eutectic flow containment in a semiconductor fabrication process

Device structures for in-plane and out-of-plane sensing micro-elect...

Method of making a micro-electro-mechanical-systems (MEMS) device

Electrical coupling of wafer structures

Method of forming a micro-electromechanical system (MEMS) having a...

Method for forming a capped micro-electro-mechanical system (MEMS)...

Method of producing microelectromechanical device with isolated mic...

Eutectic flow containment in a semiconductor fabrication process

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT HAVING VARYING SUBSTRATE DEPTH AND METHOD OF FOR...

PRESSURE LEVEL ADJUSTMENT IN A CAVITY OF A SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

INTEGRATED CIRCUIT HAVING VARYING SUBSTRATE DEPTH AND METHOD OF FOR...

ATTACHING A MEMS TO A BONDING WAFER

METHOD OF MAKING A MICRO-ELECTRO-MECHANICAL-SYSTEMS (MEMS) DEVICE

METHOD OF PRODUCING LAYERED WAFER STRUCTURE HAVING ANTI-STICTION BUMPS

METHODS FOR MAKING IN-PLANE AND OUT-OF-PLANE SENSING MICRO-ELECTRO-...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

ELECTRICAL COUPLING OF WAFER STRUCTURES

MICRO ELECTROMECHANICAL SYSTEMS (MEMS) HAVING A GAP STOP AND METHOD...

EUTECTIC FLOW CONTAINMENT IN A SEMICONDUCTOR FABRICATION PROCESS

EUTECTIC FLOW CONTAINMENT IN A SEMICONDUCTOR FABRICATION PROCESS

Method of Fabricating High Aspect Ratio Transducer Using Metal Comp...

MICROELECTROMECHANICAL DEVICE WITH ISOLATED MICROSTRUCTURES AND MET...