Litao Yang

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices including two-dimensional materials, and re...
- Patent number 11,943,919
- Issue date Mar 26, 2024
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies
- Patent number 11,935,960
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Srinivas Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including transistors, and related methods, memory devi...
- Patent number 11,653,488
- Issue date May 16, 2023
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned etch back for vertical three dimensional (3D) memory
- Patent number 11,641,732
- Issue date May 2, 2023
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having conductive material along three of fou...
- Patent number 11,600,535
- Issue date Mar 7, 2023
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having shield lines between digit lines, and...
- Patent number 11,581,317
- Issue date Feb 14, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,563,010
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal insulator semiconductor (MIS) contact in three dimensional (3...
- Patent number 11,538,809
- Issue date Dec 27, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical three-dimensional memory with vertical channel
- Patent number 11,495,600
- Issue date Nov 8, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertically separated storage nodes and access devices for semicondu...
- Patent number 11,469,230
- Issue date Oct 11, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies
- Patent number 11,411,118
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Srinivas Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Access devices formed with conductive contacts
- Patent number 11,393,928
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbody contact to horizontal access devices for vertical three-d...
- Patent number 11,164,872
- Issue date Nov 2, 2021
- Micron Technology, Inc.
- Srinivas Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors including two-dimensional materials
- Patent number 11,127,747
- Issue date Sep 21, 2021
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having shield lines between digit lines, and...
- Patent number 11,069,687
- Issue date Jul 20, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction in a semiconductor device
- Patent number 10,923,480
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Access devices formed with conductive contacts
- Patent number 10,756,217
- Issue date Aug 25, 2020
- Micron Technology, Inc.
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TWO TRANSISTOR CELLS FOR VERTICAL THREE-DIMENSIONAL MEMORY HAVING V...
- Publication number 20240357794
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Litao Yang
Information Patent Application
STRING DRIVER ASSEMBLIES INCLUDING TWO-DIMENSIONAL MATERIALS, AND R...
- Publication number 20240224516
- Publication date Jul 4, 2024
- Lodestar Licensing Group LLC
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED STORAGE NODES AND ACCESS DEVICES WITH HORIZONTAL...
- Publication number 20240064966
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED DIELECTRIC MATERIAL
- Publication number 20240064962
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO TRANSISTOR CELLS FOR VERTICAL THREE-DIMENSIONAL MEMORY
- Publication number 20230138620
- Publication date May 4, 2023
- Micron Technology, Inc.
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL THREE-DIMENSIONAL MEMORY WITH VERTICAL CHANNEL
- Publication number 20230022021
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies
- Publication number 20220352383
- Publication date Nov 3, 2022
- Micron Technology, Inc.
- Srinivas Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED ETCH BACK FOR VERTICAL THREE DIMENSIONAL (3D) MEMORY
- Publication number 20220344338
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY SEPARATED STORAGE NODES AND ACCESS DEVICES FOR SEMICONDU...
- Publication number 20220278105
- Publication date Sep 1, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH VERTICALLY RECESSED CHANNEL STRUCTURES...
- Publication number 20220238548
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL THREE-DIMENSIONAL MEMORY WITH VERTICAL CHANNEL
- Publication number 20220149046
- Publication date May 12, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies
- Publication number 20220077320
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Srinivas Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR SEMICONDUCTOR (MIS) CONTACT IN THREE DIMENSIONAL (3...
- Publication number 20220068929
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING TWO-DIMENSIONAL MATERIALS, AND RE...
- Publication number 20210375893
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies having Conductive Material Along Three of Fou...
- Publication number 20210351087
- Publication date Nov 11, 2021
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING TRANSISTORS, AND RELATED METHODS, MEMORY DEVI...
- Publication number 20210351182
- Publication date Nov 11, 2021
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Shield Lines Between Digit Lines, and...
- Publication number 20210327883
- Publication date Oct 21, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210125997
- Publication date Apr 29, 2021
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS INCLUDING TWO-DIMENSIONAL MATERIALS, AND RELATED MICROE...
- Publication number 20210057424
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS DEVICES FORMED WITH CONDUCTIVE CONTACTS
- Publication number 20200388712
- Publication date Dec 10, 2020
- Micron Technology, Inc.
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE REDUCTION IN A SEMICONDUCTOR DEVICE
- Publication number 20200357803
- Publication date Nov 12, 2020
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Shield Lines Between Digit Lines, and...
- Publication number 20200286895
- Publication date Sep 10, 2020
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS DEVICES FORMED WITH CONDUCTIVE CONTACTS
- Publication number 20190252553
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Microelectronic devices including two-dimensional materials, and re...

Integrated assemblies

Apparatuses including transistors, and related methods, memory devi...

Self-aligned etch back for vertical three dimensional (3D) memory

Integrated assemblies having conductive material along three of fou...

Integrated assemblies having shield lines between digit lines, and...

Integrated assemblies, and methods of forming integrated assemblies

Metal insulator semiconductor (MIS) contact in three dimensional (3...

Vertical three-dimensional memory with vertical channel

Vertically separated storage nodes and access devices for semicondu...

Integrated assemblies

Access devices formed with conductive contacts

Underbody contact to horizontal access devices for vertical three-d...

Transistors including two-dimensional materials

Integrated assemblies having shield lines between digit lines, and...

Capacitance reduction in a semiconductor device

Access devices formed with conductive contacts

Patents Applicationslast 30 patents

TWO TRANSISTOR CELLS FOR VERTICAL THREE-DIMENSIONAL MEMORY HAVING V...

STRING DRIVER ASSEMBLIES INCLUDING TWO-DIMENSIONAL MATERIALS, AND R...

VERTICALLY STACKED STORAGE NODES AND ACCESS DEVICES WITH HORIZONTAL...

DOPED DIELECTRIC MATERIAL

TWO TRANSISTOR CELLS FOR VERTICAL THREE-DIMENSIONAL MEMORY

VERTICAL THREE-DIMENSIONAL MEMORY WITH VERTICAL CHANNEL

Integrated Assemblies

SELF-ALIGNED ETCH BACK FOR VERTICAL THREE DIMENSIONAL (3D) MEMORY

VERTICALLY SEPARATED STORAGE NODES AND ACCESS DEVICES FOR SEMICONDU...

MICROELECTRONIC DEVICES WITH VERTICALLY RECESSED CHANNEL STRUCTURES...

VERTICAL THREE-DIMENSIONAL MEMORY WITH VERTICAL CHANNEL

Integrated Assemblies

METAL INSULATOR SEMICONDUCTOR (MIS) CONTACT IN THREE DIMENSIONAL (3...

MICROELECTRONIC DEVICES INCLUDING TWO-DIMENSIONAL MATERIALS, AND RE...

Integrated Assemblies having Conductive Material Along Three of Fou...

APPARATUSES INCLUDING TRANSISTORS, AND RELATED METHODS, MEMORY DEVI...

Integrated Assemblies Having Shield Lines Between Digit Lines, and...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

TRANSISTORS INCLUDING TWO-DIMENSIONAL MATERIALS, AND RELATED MICROE...

ACCESS DEVICES FORMED WITH CONDUCTIVE CONTACTS

CAPACITANCE REDUCTION IN A SEMICONDUCTOR DEVICE

Integrated Assemblies Having Shield Lines Between Digit Lines, and...

ACCESS DEVICES FORMED WITH CONDUCTIVE CONTACTS