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Munich, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Power electronic assembly having a laminate inlay and method of pro...
Patent number
11,903,132
Issue date
Feb 13, 2024
Infineon Technologies AG
Petteri Palm
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power electronic assembly and method of producing thereof
Patent number
11,632,860
Issue date
Apr 18, 2023
Infineon Technologies AG
Petteri Palm
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Topside-cooled semiconductor package with molded standoff
Patent number
11,239,127
Issue date
Feb 1, 2022
Infineon Technologies AG
Edward Myers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power transistor device including first and second transistor cells...
Patent number
11,127,853
Issue date
Sep 21, 2021
Infineon Technologies AG
Cristian Mihai Boianceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package having a cooling surface and method of m...
Patent number
10,727,151
Issue date
Jul 28, 2020
Infineon Technologies AG
Liu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transistor package with three-terminal clip
Patent number
10,290,567
Issue date
May 14, 2019
Infineon Technologies AG
Rainald Sander
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-functional interconnect module and carrier with multi-functio...
Patent number
10,168,391
Issue date
Jan 1, 2019
Infineon Technologies AG
Giuliano Angelo Babulano
G01 - MEASURING TESTING
Information
Patent Grant
Module with integrated power electronic circuitry and logic circuitry
Patent number
9,681,558
Issue date
Jun 13, 2017
Infineon Technologies AG
Liu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power package with integrated magnetic field sensor
Patent number
9,564,423
Issue date
Feb 7, 2017
Infineon Technologies AG
Liu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with integrated magnetic field sensor
Patent number
9,564,578
Issue date
Feb 7, 2017
Infineon Technologies AG
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overmolded substrate-chip arrangement with heat sink
Patent number
9,385,059
Issue date
Jul 5, 2016
Infineon Technologies AG
Peter Ossimitz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
POWER ELECTRONIC ASSEMBLY HAVING A LAMINATE INLAY AND METHOD OF PRO...
Publication number
20230240012
Publication date
Jul 27, 2023
INFINEON TECHNOLOGIES AG
Petteri Palm
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF
Publication number
20210398867
Publication date
Dec 23, 2021
INFINEON TECHNOLOGIES AG
Edward MYERS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Electronic Assembly and Method of Producing Thereof
Publication number
20210127490
Publication date
Apr 29, 2021
INFINEON TECHNOLOGIES AG
Petteri Palm
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Transistor Device
Publication number
20190386133
Publication date
Dec 19, 2019
INFINEON TECHNOLOGIES AG
Cristian Mihai Boianceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transistor package with three-terminal clip
Publication number
20190074243
Publication date
Mar 7, 2019
INFINEON TECHNOLOGIES AG
Rainald SANDER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Chip Package Having a Cooling Surface and Method of M...
Publication number
20180342438
Publication date
Nov 29, 2018
INFINEON TECHNOLOGIES AG
Liu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Integrated Magnetic Field Sensor
Publication number
20160380181
Publication date
Dec 29, 2016
INFINEON TECHNOLOGIES AG
Thorsten Meyer
G01 - MEASURING TESTING
Information
Patent Application
POWER PACKAGE WITH INTEGRATED MAGNETIC FIELD SENSOR
Publication number
20160379966
Publication date
Dec 29, 2016
INFINEON TECHNOLOGIES AG
Liu Chen
G01 - MEASURING TESTING
Information
Patent Application
Multi-Functional Interconnect Module and Carrier with Multi-Functio...
Publication number
20160377689
Publication date
Dec 29, 2016
INFINEON TECHNOLOGIES AG
Giuliano Angelo Babulano
G01 - MEASURING TESTING
Information
Patent Application
Module with Integrated Power Electronic Circuitry and Logic Circuitry
Publication number
20160050768
Publication date
Feb 18, 2016
INFINEON TECHNOLOGIES AG
Liu Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Overmolded substrate-chip arrangement with heat sink
Publication number
20150062825
Publication date
Mar 5, 2015
INFINEON TECHNOLOGIES AG
Peter Ossimitz
H01 - BASIC ELECTRIC ELEMENTS