Liu Hao

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Through silicon via dies and packages
- Patent number 8,741,762
- Issue date Jun 3, 2014
- United Test & Assembly Center Ltd.
- Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via dies and packages
- Patent number 8,586,465
- Issue date Nov 19, 2013
- United Test & Assembly Center Ltd.
- Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subscriber identity module (SIM) card
- Patent number 8,544,755
- Issue date Oct 1, 2013
- United Test & Assembly Center Ltd.
- Rahamat Bidin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vented die and package
- Patent number 8,426,246
- Issue date Apr 23, 2013
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold design and semiconductor package
- Patent number 8,399,985
- Issue date Mar 19, 2013
- United Test & Assembly Center Ltd.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented die and package
- Patent number 8,143,719
- Issue date Mar 27, 2012
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold design and semiconductor package
- Patent number 8,030,761
- Issue date Oct 4, 2011
- United Test & Assembly Center Ltd.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor package and method of assembly
- Patent number 7,883,938
- Issue date Feb 8, 2011
- United Test & Assembly Center Ltd.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a silicon stack semiconductor package
- Patent number 7,824,960
- Issue date Nov 2, 2010
- United Test & Assembly Center Ltd.
- Liu Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die IC package and manufacturing method
- Patent number 7,816,775
- Issue date Oct 19, 2010
- United Test & Assembly Center Limited
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with thermal enhancement and method of packaging
- Patent number 6,921,974
- Issue date Jul 26, 2005
- United Test & Assembly Center Ltd.
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH SILICON VIA DIES AND PACKAGES
- Publication number 20140045301
- Publication date Feb 13, 2014
- United Test & Assembly Center Ltd.
- Hao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED DIE AND PACKAGE
- Publication number 20120149150
- Publication date Jun 14, 2012
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD DESIGN AND SEMICONDUCTOR PACKAGE
- Publication number 20120018869
- Publication date Jan 26, 2012
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSCRIBER IDENTITY MODULE (SIM) CARD
- Publication number 20110315779
- Publication date Dec 29, 2011
- United Test & Assembly Center Ltd.
- Rahamat Bidin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stacked die semiconductor package and method of assembly
- Publication number 20090004777
- Publication date Jan 1, 2009
- United Test & Assembly Center Ltd.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DIES AND PACKAGES
- Publication number 20080303163
- Publication date Dec 11, 2008
- United Test & Assembly Center Ltd.
- Hao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED DIE AND PACKAGE
- Publication number 20080303031
- Publication date Dec 11, 2008
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING A SILICON STACK SEMICONDUCTOR PACKAGE
- Publication number 20080293186
- Publication date Nov 27, 2008
- United Test & Assembly Center Ltd.
- Liu Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD DESIGN AND SEMICONDUCTOR PACKAGE
- Publication number 20080290505
- Publication date Nov 27, 2008
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Ic Package and Manufacturing Method
- Publication number 20080150103
- Publication date Jun 26, 2008
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging circuit device and packaged device
- Publication number 20040195697
- Publication date Oct 7, 2004
- United Test & Assembly Center Ltd.
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged device and method of packaging
- Publication number 20040188864
- Publication date Sep 30, 2004
- United Test & Assembly Center Ltd.
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Through silicon via dies and packages

Through silicon via dies and packages

Subscriber identity module (SIM) card

Vented die and package

Mold design and semiconductor package

Vented die and package

Mold design and semiconductor package

Stacked die semiconductor package and method of assembly

Method of assembling a silicon stack semiconductor package

Multi-die IC package and manufacturing method

Packaged device with thermal enhancement and method of packaging

Patents Applicationslast 30 patents

THROUGH SILICON VIA DIES AND PACKAGES

VENTED DIE AND PACKAGE

MOLD DESIGN AND SEMICONDUCTOR PACKAGE

SUBSCRIBER IDENTITY MODULE (SIM) CARD

Stacked die semiconductor package and method of assembly

THROUGH SILICON VIA DIES AND PACKAGES

VENTED DIE AND PACKAGE

METHOD OF ASSEMBLING A SILICON STACK SEMICONDUCTOR PACKAGE

MOLD DESIGN AND SEMICONDUCTOR PACKAGE

Multi-Die Ic Package and Manufacturing Method

Method of packaging circuit device and packaged device

Packaged device and method of packaging