Liu Ming-Tsung

Follow

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a bonding pad
- Patent number 5,834,365
- Issue date Nov 10, 1998
- United Microelectronics Corp.
- Liu Ming-Tsung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure and method thereof
- Patent number 5,703,408
- Issue date Dec 30, 1997
- United Microelectronics Corporation
- Liu Ming-Tsung
- H01 - BASIC ELECTRIC ELEMENTS