Liu Pilin

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer package-on-package (PoP) with solder array thermal contacts
- Patent number 11,387,175
- Issue date Jul 12, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly using bismuth-rich solder
- Patent number 10,361,167
- Issue date Jul 23, 2019
- Intel Corporation
- Pilin Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joints with enhanced electromigration resistance
- Patent number 8,759,974
- Issue date Jun 24, 2014
- Intel Corporation
- Mengzhi Pang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joints with enhanced electromigration resistance
- Patent number 8,013,444
- Issue date Sep 6, 2011
- Intel Corporation
- Mengzhi Pang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURES WITH COLLAPSE CONTROL FEATURES
- Publication number 20230317630
- Publication date Oct 5, 2023
- Intel Corporation
- Wenhao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING
- Publication number 20230317675
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES
- Publication number 20230317660
- Publication date Oct 5, 2023
- Intel Corporation
- Zhaozhi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER PACKAGE-ON-PACKAGE (POP) WITH SOLDER ARRAY THERMAL CONTACTS
- Publication number 20200051899
- Publication date Feb 13, 2020
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY USING BISMUTH-RICH SOLDER
- Publication number 20180254256
- Publication date Sep 6, 2018
- Pilin Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY TO ENHANCE RELIABILITY OF SOLDER INTERCONNECTS WITH NI...
- Publication number 20150255414
- Publication date Sep 10, 2015
- Pilin Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
- Publication number 20110290864
- Publication date Dec 1, 2011
- Mengzhi PANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
- Publication number 20110293962
- Publication date Dec 1, 2011
- Mengzhi PANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
- Publication number 20100155947
- Publication date Jun 24, 2010
- Mengzhi PANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Interposer package-on-package (PoP) with solder array thermal contacts

Electronic assembly using bismuth-rich solder

Solder joints with enhanced electromigration resistance

Solder joints with enhanced electromigration resistance

Patents Applicationslast 30 patents

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

PACKAGE STRUCTURES WITH COLLAPSE CONTROL FEATURES

NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING

PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

INTERPOSER PACKAGE-ON-PACKAGE (POP) WITH SOLDER ARRAY THERMAL CONTACTS

ELECTRONIC ASSEMBLY USING BISMUTH-RICH SOLDER

SOLDER ALLOY TO ENHANCE RELIABILITY OF SOLDER INTERCONNECTS WITH NI...

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE