Liwen Jin

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Panel with releasable core
- Patent number 9,554,468
- Issue date Jan 24, 2017
- Intel Corporation
- Ching-Ping Janet Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded architecture using resin coated copper
- Patent number 9,451,696
- Issue date Sep 20, 2016
- Intel Corporation
- Dilan Seneviratne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumpless build-up layer package including a release layer
- Patent number 9,320,149
- Issue date Apr 19, 2016
- Intel Corporation
- Liwen Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20160141265
- Publication date May 19, 2016
- Intel Corporation
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL WITH RELEASABLE CORE
- Publication number 20150181713
- Publication date Jun 25, 2015
- Ching-Ping Janet Shen
- B32 - LAYERED PRODUCTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20140177193
- Publication date Jun 26, 2014
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ARCHITECTURE USING RESIN COATED COPPER
- Publication number 20140090879
- Publication date Apr 3, 2014
- Dilan SENEVIRATNE
- H01 - BASIC ELECTRIC ELEMENTS