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Hangzhou, CN
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last 30 patents
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Patent Grant
Multiple silicon trenches forming method for MEMS sealing cap wafer...
Patent number
10,513,431
Issue date
Dec 24, 2019
Hangzhou Silan Integrated Circuit Co., Ltd.
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Multiple silicon trenches forming method for MEMS sealing cap wafer...
Patent number
10,081,541
Issue date
Sep 25, 2018
Hangzhou Silan Integrated Circuit Co., Ltd.
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER...
Publication number
20180362339
Publication date
Dec 20, 2018
HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER...
Publication number
20150091140
Publication date
Apr 2, 2015
HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY