Lixiong Luo

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor including cup-shaped leadframe packaging techniques
- Patent number 9,040,356
- Issue date May 26, 2015
- Vishay Siliconix
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including cup-shaped leadframe
- Patent number 7,595,547
- Issue date Sep 29, 2009
- Vishay Siliconix
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with package using cup-shaped lead-frame
- Patent number 6,909,170
- Issue date Jun 21, 2005
- Siliconix Incorporated
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including cup-shaped leadframe
- Patent number 6,744,124
- Issue date Jun 1, 2004
- Siliconix Incorporated
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with directly connected leads
- Patent number 6,249,041
- Issue date Jun 19, 2001
- Siliconix Incorporated
- Y. Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING TECHNIQUES
- Publication number 20090256246
- Publication date Oct 15, 2009
- VISHAY-SILICONIX
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor assembly with package using cup-shaped lead frame
- Publication number 20030057532
- Publication date Mar 27, 2003
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS