Liyan SIOW

Follow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and method of acoustic device
- Patent number 11,799,440
- Issue date Oct 24, 2023
- Wuhan MEMSonics Technologies Co., Ltd.
- Zhipeng Ding
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Packaging Structure and Method of Acoustic Device
- Publication number 20230308073
- Publication date Sep 28, 2023
- Wuhan MEMSonics Technologies Co.,Ltd.
- Zhipeng DING
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Film Bulk Acoustic Resonator and Manufacturing Method therefor, and...
- Publication number 20230091745
- Publication date Mar 23, 2023
- Wuhan MEMSonics Technologies Co.,Ltd.
- Bangtao CHEN
- H03 - BASIC ELECTRONIC CIRCUITRY