Liyi Chen

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,363,891
- Issue date Jun 7, 2016
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, and method for manufacturing printed circuit...
- Patent number 9,357,660
- Issue date May 31, 2016
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed wiring board
- Patent number 9,021,692
- Issue date May 5, 2015
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,686,300
- Issue date Apr 1, 2014
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 8,419,924
- Issue date Apr 16, 2013
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed wiring board
- Patent number 8,418,360
- Issue date Apr 16, 2013
- Ibiden Co., Ld.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic wiring board, optical communication device, and meth...
- Patent number 8,311,375
- Issue date Nov 13, 2012
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 8,188,380
- Issue date May 29, 2012
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer, a method for manufacturing the same and an electronic c...
- Patent number 7,911,802
- Issue date Mar 22, 2011
- Ibiden Co., Ltd.
- Shuichi Kawano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package board integrated with power supply
- Patent number 7,751,205
- Issue date Jul 6, 2010
- Ibiden Co., Ltd.
- Takashi Kariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic wiring board, optical communication device, and meth...
- Patent number 7,734,125
- Issue date Jun 8, 2010
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical and electrical circuit board and method of manufacturing th...
- Patent number 7,676,123
- Issue date Mar 9, 2010
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20240186056
- Publication date Jun 6, 2024
- TDK Corporation
- Yuuichi KAWAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20230420176
- Publication date Dec 28, 2023
- TDK Corporation
- Yuuichi KAWAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20230420184
- Publication date Dec 28, 2023
- TDK Corporation
- Yuuichi KAWAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20210280353
- Publication date Sep 9, 2021
- TDK Corporation
- Masaki ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150216050
- Publication date Jul 30, 2015
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOA...
- Publication number 20140118976
- Publication date May 1, 2014
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20120247818
- Publication date Oct 4, 2012
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20120229990
- Publication date Sep 13, 2012
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20120199386
- Publication date Aug 9, 2012
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120066901
- Publication date Mar 22, 2012
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20120061347
- Publication date Mar 15, 2012
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20110000708
- Publication date Jan 6, 2011
- IBIDEN CO., LTD.
- Toru NAKAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METH...
- Publication number 20100202729
- Publication date Aug 12, 2010
- IBIDEN CO., LTD.
- Hiroaki Kodama
- G02 - OPTICS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20100163293
- Publication date Jul 1, 2010
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100155116
- Publication date Jun 24, 2010
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METH...
- Publication number 20090028497
- Publication date Jan 29, 2009
- IBIDEN CO., LTD.
- Hiroaki Kodama
- G02 - OPTICS
Information Patent Application
OPTICAL AND ELECTRICAL CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...
- Publication number 20090010594
- Publication date Jan 8, 2009
- IBIDEN CO., LTD.
- Hiroaki KODAMA
- G02 - OPTICS
Information Patent Application
INTERPOSER, A METHOD FOR MANUFACTURING THE SAME AND AN ELECTRONIC C...
- Publication number 20080247116
- Publication date Oct 9, 2008
- IBIDEN CO., LTD.
- Shuichi KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package board integrated with power supply
- Publication number 20080007925
- Publication date Jan 10, 2008
- IBIDEN, CO., LTD.
- Takashi Kariya
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Printed wiring board and method for manufacturing the same

Printed circuit board, and method for manufacturing printed circuit...

Method for manufacturing a printed wiring board

Printed wiring board and method for manufacturing the same

Wiring substrate and method for manufacturing wiring substrate

Method for manufacturing a printed wiring board

Optoelectronic wiring board, optical communication device, and meth...

Printed wiring board and method for manufacturing printed wiring board

Interposer, a method for manufacturing the same and an electronic c...

Package board integrated with power supply

Optoelectronic wiring board, optical communication device, and meth...

Optical and electrical circuit board and method of manufacturing th...

Patents Applicationslast 30 patents

COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

COIL COMPONENT

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOA...

PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

MULTILAYER PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METH...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METH...

OPTICAL AND ELECTRICAL CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...

INTERPOSER, A METHOD FOR MANUFACTURING THE SAME AND AN ELECTRONIC C...

Package board integrated with power supply