Lizabeth Ann A. Keser

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Redistributed chip packaging with thermal contact to device backside
- Patent number 8,217,511
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20120252169
- Publication date Oct 4, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING INTEGRATED CIRCUIT DIES WITH THERMAL DISSIPATIO...
- Publication number 20100148357
- Publication date Jun 17, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Liyu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20090032933
- Publication date Feb 5, 2009
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS