Lizabeth Ann Keser

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,211,796
- Issue date Jan 28, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package formation methods including coupling a molded routing layer...
- Patent number 12,057,364
- Issue date Aug 6, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus, and method for embedding a 3D component with an...
- Patent number 10,163,687
- Issue date Dec 25, 2018
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising mold for top side and sidewall prot...
- Patent number 10,141,202
- Issue date Nov 27, 2018
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for embedding a device in a faceup wo...
- Patent number 9,985,010
- Issue date May 29, 2018
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar fan-out wafer level packaging
- Patent number 9,806,048
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package interconnect
- Patent number 9,806,052
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit (IC) package comprising a plurality...
- Patent number 9,679,873
- Issue date Jun 13, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (POP) device comprising solder connections betwe...
- Patent number 9,601,472
- Issue date Mar 21, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack stopping structure in wafer level packaging (WLP)
- Patent number 9,379,065
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package without sidewall cracking
- Patent number 9,318,405
- Issue date Apr 19, 2016
- QUALCOMM Incorporated
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising wires as vias in an encapsulation layer
- Patent number 9,209,110
- Issue date Dec 8, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked redistribution layers on die
- Patent number 9,171,782
- Issue date Oct 27, 2015
- QUALCOMM Incorporated
- Christine Sung-An Hau-Riege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for singulating electronic components from a substrate
- Patent number 9,142,434
- Issue date Sep 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of packaging an electronic device
- Patent number 9,054,111
- Issue date Jun 9, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for thermal management in a multi-layer embed...
- Patent number 7,405,102
- Issue date Jul 29, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Tien Yu T. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simplification of ball attach method using super-saturated fine cry...
- Patent number 7,108,755
- Issue date Sep 19, 2006
- Motorola, Inc.
- Li Ann Wetz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Under bump metallurgy structural design for high reliability bumped...
- Patent number 6,930,032
- Issue date Aug 16, 2005
- Freescale Semiconductor, Inc.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress compensation composition and semiconductor component formed...
- Patent number 6,458,622
- Issue date Oct 1, 2002
- Motorola, Inc.
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...
- Publication number 20240355697
- Publication date Oct 24, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR SEMICONDUCTOR DEVICES
- Publication number 20230317620
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
- Publication number 20230317551
- Publication date Oct 5, 2023
- Intel Corporation
- Vishnu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
- Publication number 20230317582
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS BRIDGE FOR CONNECTING DIES
- Publication number 20230317618
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
- Publication number 20230282615
- Publication date Sep 7, 2023
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE AND METHODS
- Publication number 20230090265
- Publication date Mar 23, 2023
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415806
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415815
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415814
- Publication date Dec 29, 2022
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415805
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...
- Publication number 20170373032
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Jihoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20170271289
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Lizabeth Ann KESER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECT
- Publication number 20170077053
- Publication date Mar 16, 2017
- QUALCOMM Incorporated
- Lizabeth Ann KESER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...
- Publication number 20160372446
- Publication date Dec 22, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO INTERCONNECT FOR WAFER LEVEL PACKAGE (WLP) AND IN...
- Publication number 20160343646
- Publication date Nov 24, 2016
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN...
- Publication number 20160343651
- Publication date Nov 24, 2016
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WO...
- Publication number 20160343635
- Publication date Nov 24, 2016
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWE...
- Publication number 20160315072
- Publication date Oct 27, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING WIRES AS VIAS IN AN ENCAPSULATION LAYER
- Publication number 20150325496
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING T...
- Publication number 20150318229
- Publication date Nov 5, 2015
- QUALCOMM Incorporated
- Jianwen XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20150228594
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK STOPPING STRUCTURE IN WAFER LEVEL PACKAGING (WLP)
- Publication number 20150048517
- Publication date Feb 19, 2015
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED REDISTRIBUTION LAYERS ON DIE
- Publication number 20150041982
- Publication date Feb 12, 2015
- QUALCOMM Incorporated
- Christine Sung-An Hau-Riege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING MOLD FOR TOP SIDE AND SIDEWALL PROT...
- Publication number 20140339712
- Publication date Nov 20, 2014
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE
- Publication number 20110217814
- Publication date Sep 8, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE
- Publication number 20100252919
- Publication date Oct 7, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...
- Publication number 20080182363
- Publication date Jul 31, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS

Lizabeth Ann Keser

Person

Patents Grantslast 30 patents

Microelectronic assemblies having topside power delivery structures

Package formation methods including coupling a molded routing layer...

System, apparatus, and method for embedding a 3D component with an...

Semiconductor device comprising mold for top side and sidewall prot...

System, apparatus, and method for embedding a device in a faceup wo...

Planar fan-out wafer level packaging

Semiconductor package interconnect

Low profile integrated circuit (IC) package comprising a plurality...

Package on package (POP) device comprising solder connections betwe...

Crack stopping structure in wafer level packaging (WLP)

Wafer level package without sidewall cracking

Integrated device comprising wires as vias in an encapsulation layer

Stacked redistribution layers on die

Method for singulating electronic components from a substrate

Electronic device and method of packaging an electronic device

Methods and apparatus for thermal management in a multi-layer embed...

Simplification of ball attach method using super-saturated fine cry...

Under bump metallurgy structural design for high reliability bumped...

Stress compensation composition and semiconductor component formed...

Patents Applicationslast 30 patents

PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...

INTERPOSERS FOR SEMICONDUCTOR DEVICES

HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

THIN CLIENT FORM FACTOR ASSEMBLY

GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION

GLASS BRIDGE FOR CONNECTING DIES

THREE-DIMENSIONAL STACK COOLING WINGS

STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER

FAN OUT PACKAGE AND METHODS

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...

PLANAR FAN-OUT WAFER LEVEL PACKAGING

SEMICONDUCTOR PACKAGE INTERCONNECT

LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...

HIGH ASPECT RATIO INTERCONNECT FOR WAFER LEVEL PACKAGE (WLP) AND IN...

SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN...

SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WO...

PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWE...

INTEGRATED DEVICE COMPRISING WIRES AS VIAS IN AN ENCAPSULATION LAYER

WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING T...

VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES

CRACK STOPPING STRUCTURE IN WAFER LEVEL PACKAGING (WLP)

STACKED REDISTRIBUTION LAYERS ON DIE

SEMICONDUCTOR DEVICE COMPRISING MOLD FOR TOP SIDE AND SIDEWALL PROT...

METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE

ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE

METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...