Lloyd Andre Walls

Person

Ausitn, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing printed circuit boards with routing conductors...
- Patent number 11,596,054
- Issue date Feb 28, 2023
- International Business Machines Corporation
- Yanyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed chip substrate test fixture
- Patent number 10,705,134
- Issue date Jul 7, 2020
- International Business Machines Corporation
- Lloyd A. Walls
- G01 - MEASURING TESTING
Information Patent Grant
Noise modulation for on-chip noise measurement
- Patent number 10,620,253
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Jose A. Hejase
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board with routing of a conductor and dielectric st...
- Patent number 10,542,618
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Yanyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for performing frequency band splitting
- Patent number 9,893,400
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Jose A. Hejase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noise modulation for on-chip noise measurement
- Patent number 9,835,665
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Jose A. Hejase
- G01 - MEASURING TESTING
Information Patent Grant
Noise modulation for on-chip noise measurement
- Patent number 9,797,938
- Issue date Oct 24, 2017
- International Business Machines Corporation
- Jose A. Hejase
- G01 - MEASURING TESTING
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 9,548,769
- Issue date Jan 17, 2017
- International Business Machines Corporation
- Kevin J. Bills
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Impedance matching system for DDR memory
- Patent number 9,536,604
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Daniel M. Dreps
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for performing frequency band splitting
- Patent number 9,368,852
- Issue date Jun 14, 2016
- International Business Machines Corporation
- Jose A. Hejase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having DC blocking dielectric waveguide vias
- Patent number 9,253,874
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Jose A. Hajase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level connector and use thereof that mitigates data signaling...
- Patent number 9,209,583
- Issue date Dec 8, 2015
- International Business Machines Corporation
- Michael D. Hasse
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-level connector and use thereof that mitigates data signaling...
- Patent number 9,118,144
- Issue date Aug 25, 2015
- International Business Machines Corporation
- Michael D. Hasse
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 8,743,558
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fabrication method for circuit substrate having post-fed die side p...
- Patent number 8,722,536
- Issue date May 13, 2014
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuously referencing signals over multiple layers in laminate p...
- Patent number 8,716,851
- Issue date May 6, 2014
- International Business Machines Corporation
- Francesco Preda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for circuit substrate having post-fed die side p...
- Patent number 8,586,476
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered thermal sensor for integrated circuits and other laye...
- Patent number 8,425,115
- Issue date Apr 23, 2013
- International Business Machines Corporation
- Aquilur Rahman
- G01 - MEASURING TESTING
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 8,358,509
- Issue date Jan 22, 2013
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Continuously referencing signals over multiple layers in laminate p...
- Patent number 8,158,461
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Francesco Preda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered thermal sensor for integrated circuits and other laye...
- Patent number 7,946,763
- Issue date May 24, 2011
- International Business Machines Corporation
- Aquilur Rahman
- G01 - MEASURING TESTING
Information Patent Grant
Circuit substrate having post-fed die side power supply connections
- Patent number 7,863,724
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered thermal sensor for integrated circuits and other laye...
- Patent number 7,510,323
- Issue date Mar 31, 2009
- International Business Machines Corporation
- Aquilur Rahman
- G01 - MEASURING TESTING
Information Patent Grant
Circuit for facilitating simultaneous multi-directional transmissio...
- Patent number 7,095,788
- Issue date Aug 22, 2006
- International Business Machines Corporation
- Tai Anh Cao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for facilitating simultaneous multi-directional transmission...
- Patent number 6,771,675
- Issue date Aug 3, 2004
- International Business Machines Corporation
- Tai Anh Cao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuitry for allowing two drivers to communicate with two receiver...
- Patent number 6,337,884
- Issue date Jan 8, 2002
- International Business Machines Corporation
- Tai Cao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuitry for allowing two drivers to communicate with two receiver...
- Patent number 5,864,584
- Issue date Jan 26, 1999
- International Business Machines Corporation
- Tai Cao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Impedence self-adjusting driver circuit
- Patent number 5,789,937
- Issue date Aug 4, 1998
- International Business Machines Corporation
- Tai Any Cao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Controllable decoupling capacitor
- Patent number 5,770,969
- Issue date Jun 23, 1998
- International Business Machines Corporation
- Lloyd Andre Walls
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit for multiplexing a plurality of signals on one transmission...
- Patent number 5,761,246
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Tai Anh Cao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY
- Publication number 20240008186
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Yanyan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board with Routing of a Conductor and Dielectric St...
- Publication number 20200092980
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Yanyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED CHIP SUBSTRATE TEST FIXTURE
- Publication number 20190170809
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Lloyd A. Walls
- G01 - MEASURING TESTING
Information Patent Application
NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT
- Publication number 20180045766
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Jose A. Hejase
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PERFORMING FREQUENCY BAND SPLITTING
- Publication number 20160118706
- Publication date Apr 28, 2016
- International Business Machines Corporation
- JOSE A. HEJASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING FREQUENCY BAND SPLITTING
- Publication number 20160118703
- Publication date Apr 28, 2016
- International Business Machines Corporation
- JOSE A. HEJASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT
- Publication number 20150276838
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Jose A. Hejase
- G01 - MEASURING TESTING
Information Patent Application
NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT
- Publication number 20150276840
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Jose A. Hejase
- G01 - MEASURING TESTING
Information Patent Application
Reduced Wiring Requirements With Signal Slope Manipulation
- Publication number 20140226749
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Plating Stub Resonance Shift with Filter Stub Design Methodology
- Publication number 20140167886
- Publication date Jun 19, 2014
- International Business Machines Corporation
- Nanju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING DC BLOCKING DIELECTRIC WAVEGUIDE VIAS
- Publication number 20140097918
- Publication date Apr 10, 2014
- International Business Machines Corporation
- Jose A. Hajase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Level Connector and Use Thereof that Mitigates Data Signaling...
- Publication number 20140075748
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Michael D. Hasse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Level Connector and Use Thereof that Mitigates Data Signaling...
- Publication number 20130330940
- Publication date Dec 12, 2013
- International Business Machines Corporation
- Michael D. Hasse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating Stub Resonance Shift with Filter Stub Design Methodology
- Publication number 20130328645
- Publication date Dec 12, 2013
- International Business Machines Corporation
- Nanju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...
- Publication number 20130316534
- Publication date Nov 28, 2013
- International Business Machines Corporation
- Daniel Douriet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION
- Publication number 20130010445
- Publication date Jan 10, 2013
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Continuously Referencing Signals Over Multiple Layers in Laminate P...
- Publication number 20120174047
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTI-LAYERED THERMAL SENSOR FOR INTEGRATED CIRCUITS AND OTHER LAYE...
- Publication number 20110176579
- Publication date Jul 21, 2011
- International Business Machines Corporation
- Aquilur Rahman
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...
- Publication number 20100330797
- Publication date Dec 30, 2010
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION
- Publication number 20100195756
- Publication date Aug 5, 2010
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Continuously Referencing Signals Over Multiple Layers in Laminate P...
- Publication number 20090256253
- Publication date Oct 15, 2009
- International Business Machines Corporation
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit Substrate Having Post-Fed Die Side Power Supply Connections
- Publication number 20090200074
- Publication date Aug 13, 2009
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layered Thermal Sensor for Integrated Circuits and Other Laye...
- Publication number 20090135883
- Publication date May 28, 2009
- International Business Machines Corporation
- Aquilur Rahman
- G01 - MEASURING TESTING
Information Patent Application
Continuously Referencing Signals over Multiple Layers in Laminate P...
- Publication number 20080093726
- Publication date Apr 24, 2008
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-layered thermal sensor for integrated circuits and other laye...
- Publication number 20070215973
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Aquilur Rahman
- G01 - MEASURING TESTING

Lloyd Andre Walls

Person

Patents Grantslast 30 patents

Method of producing printed circuit boards with routing conductors...

High speed chip substrate test fixture

Noise modulation for on-chip noise measurement

Printed circuit board with routing of a conductor and dielectric st...

Method for performing frequency band splitting

Noise modulation for on-chip noise measurement

Noise modulation for on-chip noise measurement

Reduced wiring requirements with signal slope manipulation

Impedance matching system for DDR memory

Method for performing frequency band splitting

Printed circuit board having DC blocking dielectric waveguide vias

Multi-level connector and use thereof that mitigates data signaling...

Multi-level connector and use thereof that mitigates data signaling...

Reduced wiring requirements with signal slope manipulation

Fabrication method for circuit substrate having post-fed die side p...

Continuously referencing signals over multiple layers in laminate p...

Fabrication method for circuit substrate having post-fed die side p...

Multi-layered thermal sensor for integrated circuits and other laye...

Reduced wiring requirements with signal slope manipulation

Continuously referencing signals over multiple layers in laminate p...

Multi-layered thermal sensor for integrated circuits and other laye...

Circuit substrate having post-fed die side power supply connections

Multi-layered thermal sensor for integrated circuits and other laye...

Circuit for facilitating simultaneous multi-directional transmissio...

Method for facilitating simultaneous multi-directional transmission...

Circuitry for allowing two drivers to communicate with two receiver...

Circuitry for allowing two drivers to communicate with two receiver...

Impedence self-adjusting driver circuit

Controllable decoupling capacitor

Circuit for multiplexing a plurality of signals on one transmission...

Patents Applicationslast 30 patents

REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY

Printed Circuit Board with Routing of a Conductor and Dielectric St...

HIGH SPEED CHIP SUBSTRATE TEST FIXTURE

NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT

METHOD FOR PERFORMING FREQUENCY BAND SPLITTING

METHOD FOR PERFORMING FREQUENCY BAND SPLITTING

NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT

NOISE MODULATION FOR ON-CHIP NOISE MEASUREMENT

Reduced Wiring Requirements With Signal Slope Manipulation

Plating Stub Resonance Shift with Filter Stub Design Methodology

PRINTED CIRCUIT BOARD HAVING DC BLOCKING DIELECTRIC WAVEGUIDE VIAS

Multi-Level Connector and Use Thereof that Mitigates Data Signaling...

Multi-Level Connector and Use Thereof that Mitigates Data Signaling...

Plating Stub Resonance Shift with Filter Stub Design Methodology

FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...

REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION

Continuously Referencing Signals Over Multiple Layers in Laminate P...

MULTI-LAYERED THERMAL SENSOR FOR INTEGRATED CIRCUITS AND OTHER LAYE...

FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...

REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION

Continuously Referencing Signals Over Multiple Layers in Laminate P...

Circuit Substrate Having Post-Fed Die Side Power Supply Connections

Multi-Layered Thermal Sensor for Integrated Circuits and Other Laye...

Continuously Referencing Signals over Multiple Layers in Laminate P...

Multi-layered thermal sensor for integrated circuits and other laye...