Logan Jae Hwang

Person

Flower Mound, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Spring contact and socket having spring contact embedded therein
- Patent number 12,061,212
- Issue date Aug 13, 2024
- HICON CO., LTD.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Spring contact and test socket with same
- Patent number 11,982,688
- Issue date May 14, 2024
- Hicon Co., Ltd.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Contact and socket device for burning-in and testing semiconductor IC
- Patent number 11,668,744
- Issue date Jun 6, 2023
- Dong Weon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring contact and test socket with same
- Patent number 11,561,241
- Issue date Jan 24, 2023
- Hicon Co., Ltd.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Contact pin for testing semiconductor IC for high speed signal, spr...
- Patent number 11,387,584
- Issue date Jul 12, 2022
- Dong Weon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BGA socket device for testing BGA IC
- Patent number 10,971,843
- Issue date Apr 6, 2021
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Contact and socket device for testing semiconductor
- Patent number 10,955,438
- Issue date Mar 23, 2021
- Dong Weon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket device for testing IC
- Patent number 10,466,273
- Issue date Nov 5, 2019
- Dong Weon Hwang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MEMORY MODULE SOCKET
- Publication number 20240069607
- Publication date Feb 29, 2024
- HICON CO., LTD.
- Dong Weon HWANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPRING CONTACT AND TEST SOCKET WITH SAME
- Publication number 20230043825
- Publication date Feb 9, 2023
- HICON CO., LTD.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Application
SPRING CONTACT AND SOCKET HAVING SPRING CONTACT EMBEDDED THEREIN
- Publication number 20220206041
- Publication date Jun 30, 2022
- HICON CO., LTD.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Application
CONTACT PIN FOR TESTING SEMICONDUCTOR IC FOR HIGH SPEED SIGNAL, SPR...
- Publication number 20220209449
- Publication date Jun 30, 2022
- HICON CO., LTD.
- Dong Weon HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND SOCKET DEVICE FOR BURNING-IN AND TESTING SEMICONDUCTOR IC
- Publication number 20220196727
- Publication date Jun 23, 2022
- HICON CO., LTD.
- Dong Weon HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDLESS BGA SOCKET APPARATUS FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20220163561
- Publication date May 26, 2022
- HICON CO., LTD.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Application
SPRING CONTACT AND TEST SOCKET WITH SAME
- Publication number 20210102973
- Publication date Apr 8, 2021
- HICON CO., LTD.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Application
BGA SOCKET DEVICE FOR TESTING BGA IC
- Publication number 20200176910
- Publication date Jun 4, 2020
- Dong Weon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND SOCKET DEVICE FOR TESTING SEMICONDUCTOR
- Publication number 20200049736
- Publication date Feb 13, 2020
- Dong Weon Hwang
- G01 - MEASURING TESTING

Logan Jae Hwang

Person

Patents Grantslast 30 patents

Spring contact and socket having spring contact embedded therein

Spring contact and test socket with same

Contact and socket device for burning-in and testing semiconductor IC

Spring contact and test socket with same

Contact pin for testing semiconductor IC for high speed signal, spr...

BGA socket device for testing BGA IC

Contact and socket device for testing semiconductor

Socket device for testing IC

Patents Applicationslast 30 patents

MEMORY MODULE SOCKET

SPRING CONTACT AND TEST SOCKET WITH SAME

SPRING CONTACT AND SOCKET HAVING SPRING CONTACT EMBEDDED THEREIN

CONTACT PIN FOR TESTING SEMICONDUCTOR IC FOR HIGH SPEED SIGNAL, SPR...

CONTACT AND SOCKET DEVICE FOR BURNING-IN AND TESTING SEMICONDUCTOR IC

LIDLESS BGA SOCKET APPARATUS FOR TESTING SEMICONDUCTOR DEVICE

SPRING CONTACT AND TEST SOCKET WITH SAME

BGA SOCKET DEVICE FOR TESTING BGA IC

CONTACT AND SOCKET DEVICE FOR TESTING SEMICONDUCTOR