Loic Renard

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Agrate Brianza, IT

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Patents Grantslast 30 patents

Information Patent Grant
Gold bumps bonding on connection pads and subsequent coining of the...
- Patent number 6,260,753
- Issue date Jul 17, 2001
- STMicroelectronics S.r.l.
- Loïc Renard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor electronic device and method of manufacturing thereof
- Publication number 20040072396
- Publication date Apr 15, 2004
- STMicroelectronics S.r.I.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for semiconductor device with ground lead connection having...
- Publication number 20030146500
- Publication date Aug 7, 2003
- STMicroelectronics S.r.l.
- Battista Vitali
- H01 - BASIC ELECTRIC ELEMENTS