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Loic SANCHEZ
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Voiron, FR
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Patents Grants
last 30 patents
Information
Patent Grant
Method for transferring chips
Patent number
11,694,991
Issue date
Jul 4, 2023
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Frank Fournel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for direct bonding with self-alignment using ultrasound
Patent number
10,438,921
Issue date
Oct 8, 2019
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Frank Fournel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etching method for forming a carrier having inward side walls in pa...
Patent number
9,586,207
Issue date
Mar 7, 2017
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Sebastien Mermoz
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Device and method for individual support of components
Patent number
9,455,174
Issue date
Sep 27, 2016
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Loic Sanchez
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for producing at least one pad assembly on a support for the...
Patent number
9,240,389
Issue date
Jan 19, 2016
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Léa Di Cioccio
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS
Publication number
20230207515
Publication date
Jun 29, 2023
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Frank Fournel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING
Publication number
20230029338
Publication date
Jan 26, 2023
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Frank FOURNEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR TRANSFERRING CHIPS
Publication number
20210407961
Publication date
Dec 30, 2021
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Frank FOURNEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR DIRECT BONDING WITH SELF-ALIGNMENT USING ULTRASOUND
Publication number
20180218997
Publication date
Aug 2, 2018
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Frank FOURNEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHING METHOD FOR FORMING A CARRIER HAVING INWARD SIDE WALLS IN PA...
Publication number
20160144365
Publication date
May 26, 2016
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Sebastien MERMOZ
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE...
Publication number
20150287695
Publication date
Oct 8, 2015
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Léa Di Cioccio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR INDIVIDUAL SUPPORT OF COMPONENTS
Publication number
20140044516
Publication date
Feb 13, 2014
Loic SANCHEZ
H01 - BASIC ELECTRIC ELEMENTS