Loke-Yip Foo

Person

Ipoh, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,237,245
- Issue date Feb 25, 2025
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,125,768
- Issue date Oct 22, 2024
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assemblies
- Patent number 11,805,602
- Issue date Oct 31, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded dual-sided interconnect bridges for integrated-circuit pac...
- Patent number 11,562,959
- Issue date Jan 24, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package with flyover bridge
- Patent number 11,527,481
- Issue date Dec 13, 2022
- Intel Corporation
- Choong Kooi Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded interconnect bridge devices and methods
- Patent number 11,393,758
- Issue date Jul 19, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 11,107,751
- Issue date Aug 31, 2021
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of an embedded die
- Patent number 9,978,735
- Issue date May 22, 2018
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to optimize general-purpose input/output interface pad assig...
- Patent number 9,842,181
- Issue date Dec 12, 2017
- Altera Corporation
- Kyung Suk Oh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optimizing logic in non-reprogrammable logic devices
- Patent number 7,081,772
- Issue date Jul 25, 2006
- Altera Corporation
- Loke-Yip Foo
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20250022774
- Publication date Jan 16, 2025
- Altera Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR BRIDGE FOR MULTI-CHIP PACKAGE
- Publication number 20240063148
- Publication date Feb 22, 2024
- Intel Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20230137035
- Publication date May 4, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH POWER DELIVERY NETWORK
- Publication number 20230119525
- Publication date Apr 20, 2023
- Intel Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLIES
- Publication number 20220078914
- Publication date Mar 10, 2022
- Intel Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE WITH FLYOVER BRIDGE
- Publication number 20220077070
- Publication date Mar 10, 2022
- Intel Corporation
- Choong Kooi CHEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20210391238
- Publication date Dec 16, 2021
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DUAL-SIDED INTERCONNECT BRIDGES FOR INTEGRATED-CIRCUIT PAC...
- Publication number 20210098375
- Publication date Apr 1, 2021
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED INTERCONNECT BRIDGE DEVICES AND METHODS
- Publication number 20200083170
- Publication date Mar 12, 2020
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20190304876
- Publication date Oct 3, 2019
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF AN EMBEDDED DIE
- Publication number 20180090474
- Publication date Mar 29, 2018
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS

Loke-Yip Foo

Person

Patents Grantslast 30 patents

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Chip assemblies

Embedded dual-sided interconnect bridges for integrated-circuit pac...

Stacked semiconductor package with flyover bridge

Power delivery for embedded interconnect bridge devices and methods

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Interconnection of an embedded die

Method to optimize general-purpose input/output interface pad assig...

Optimizing logic in non-reprogrammable logic devices

Patents Applicationslast 30 patents

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

DEEP TRENCH CAPACITOR BRIDGE FOR MULTI-CHIP PACKAGE

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

PACKAGE SUBSTRATE WITH POWER DELIVERY NETWORK

CHIP ASSEMBLIES

STACKED SEMICONDUCTOR PACKAGE WITH FLYOVER BRIDGE

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

EMBEDDED DUAL-SIDED INTERCONNECT BRIDGES FOR INTEGRATED-CIRCUIT PAC...

POWER DELIVERY FOR EMBEDDED INTERCONNECT BRIDGE DEVICES AND METHODS

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

INTERCONNECTION OF AN EMBEDDED DIE