Long Hua Lee

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming integrated fan-out packages with built-in heat sink
- Patent number 12,148,661
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 12,080,617
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 11,842,936
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 11,621,205
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 11,257,715
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of a semiconductor device
- Patent number 11,201,097
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of a semiconductor device
- Patent number 11,121,050
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 11,075,133
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,024,616
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 10,510,595
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die gap control for semiconductor structure and method
- Patent number 10,157,879
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for three dimensional integrated circuit
- Patent number 9,337,063
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die gap control for semiconductor structure and method
- Patent number 8,963,334
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,941,244
- Issue date Jan 27, 2015
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for three dimensional integrated circuit
- Patent number 8,772,929
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for de-bonding carriers
- Patent number 8,629,043
- Issue date Jan 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug-in type of safety wall switch and wall outlet
- Patent number 4,485,282
- Issue date Nov 27, 1984
- Long-River Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Underfill Structure for Semiconductor Packages and Methods of Formi...
- Publication number 20230253280
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20220199465
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Structure for Semiconductor Packages and Methods of Formi...
- Publication number 20210358825
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Structure for Semiconductor Packages and Methods of Formi...
- Publication number 20210210400
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200365571
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20200006136
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Structure for Semiconductor Packages and Methods of Formi...
- Publication number 20200006181
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacture of a Semiconductor Device
- Publication number 20200006178
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20190333811
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20190006256
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-to-Die Gap Control for Semiconductor Structure and Method
- Publication number 20150125994
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150008586
- Publication date Jan 8, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- PO-HAO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for Three Dimensional Integrated Circuit
- Publication number 20140322866
- Publication date Oct 30, 2014
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for De-Bonding Carriers
- Publication number 20130122689
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for Three Dimensional Integrated Circuit
- Publication number 20130119533
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-to-Die Gap Control for Semiconductor Structure and Method
- Publication number 20130049216
- Publication date Feb 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Long Hua Lee

Person

Patents Grantslast 30 patents

Method of forming integrated fan-out packages with built-in heat sink

Underfill structure for semiconductor packages and methods of formi...

Underfill structure for semiconductor packages and methods of formi...

Underfill structure for semiconductor packages and methods of formi...

Integrated fan-out packages and methods of forming the same

Method of manufacture of a semiconductor device

Method of manufacture of a semiconductor device

Underfill structure for semiconductor packages and methods of formi...

Package structure and method of manufacturing the same

Integrated fan-out packages and methods of forming the same

Die-to-die gap control for semiconductor structure and method

Package for three dimensional integrated circuit

Die-to-die gap control for semiconductor structure and method

Semiconductor device and manufacturing method thereof

Package for three dimensional integrated circuit

Methods for de-bonding carriers

Plug-in type of safety wall switch and wall outlet

Patents Applicationslast 30 patents

Underfill Structure for Semiconductor Packages and Methods of Formi...

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

Underfill Structure for Semiconductor Packages and Methods of Formi...

Underfill Structure for Semiconductor Packages and Methods of Formi...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

Underfill Structure for Semiconductor Packages and Methods of Formi...

Method of Manufacture of a Semiconductor Device

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

Semiconductor Device and Method of Manufacture

Die-to-Die Gap Control for Semiconductor Structure and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Package for Three Dimensional Integrated Circuit

Methods for De-Bonding Carriers

Package for Three Dimensional Integrated Circuit

Die-to-Die Gap Control for Semiconductor Structure and Method