Long-Kun Yu

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New Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package assembly with thermal recycling function
- Patent number 9,837,595
- Issue date Dec 5, 2017
- Mediatek Inc.
- Long-Kun Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
High-speed-transmission connection device having a metal protrusion...
- Patent number 9,548,573
- Issue date Jan 17, 2017
- Mediatek Inc.
- Long-Kun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for performing chip level electromagnetic interference reduc...
- Patent number 9,204,581
- Issue date Dec 1, 2015
- MediaTek Inc.
- Long-Kun Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power circuits for power amplifiers and communication systems using...
- Patent number 8,026,766
- Issue date Sep 27, 2011
- Mediatek Inc.
- Long-Kun Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH THERMAL RECYCLING FUNCTION
- Publication number 20160343929
- Publication date Nov 24, 2016
- MEDIATEK INC.
- Long-Kun YU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HIGH-SPEED-TRANSMISSION CONNECTION DEVICE
- Publication number 20150295360
- Publication date Oct 15, 2015
- MEDIATEK INC.
- Long-Kun YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING CHIP LEVEL ELECTROMAGNETIC INTERFERENCE REDUC...
- Publication number 20130120958
- Publication date May 16, 2013
- MEDIATEK INC.
- Long-Kun Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CIRCUITS FOR POWER AMPLIFIERS AND COMMUNICATION SYSTEMS USING...
- Publication number 20100244957
- Publication date Sep 30, 2010
- MEDIATEK INC.
- Long-Kun Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE