Long-Sheng YEOU

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method for forming the same
- Patent number 9,559,001
- Issue date Jan 31, 2017
- Xintec Inc.
- Yu-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,184,092
- Issue date Nov 10, 2015
- Xintec Inc.
- Yu-Lin Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor stack structure and fabrication method thereof
- Patent number 9,177,862
- Issue date Nov 3, 2015
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method for a chip package
- Patent number 9,064,950
- Issue date Jun 23, 2015
- Xintec Inc.
- Chia-Lun Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,951,836
- Issue date Feb 10, 2015
- Xintec, Inc.
- Yu-Lin Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 8,698,316
- Issue date Apr 15, 2014
- Yu-Lin Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 8,692,382
- Issue date Apr 8, 2014
- Yu-Lin Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,637,970
- Issue date Jan 28, 2014
- Chia-Lun Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,552,565
- Issue date Oct 8, 2013
- Yu-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,525,345
- Issue date Sep 3, 2013
- Yu-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 8,207,615
- Issue date Jun 26, 2012
- Bai-Yao Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage container for detecting presence of checmical elements
- Patent number 7,815,856
- Issue date Oct 19, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kwang-Chen Wu
- G01 - MEASURING TESTING
Information Patent Grant
Production and packaging control for repaired integrated circuits
- Patent number 7,521,266
- Issue date Apr 21, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming undoped/in-situ doped/undoped polysilicon sandwic...
- Patent number 5,840,607
- Issue date Nov 24, 1998
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Ker Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step planarization process using chemical-mechanical polishing...
- Patent number 5,747,382
- Issue date May 5, 1998
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140199830
- Publication date Jul 17, 2014
- Xintec Inc.
- Yu-Lin YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140199835
- Publication date Jul 17, 2014
- Xintec Inc.
- Yu-Lin YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140113412
- Publication date Apr 24, 2014
- Xintec Inc.
- Chia-Lun TSAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STACK STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20130168868
- Publication date Jul 4, 2013
- Xintec Inc.
- Yeh-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP SUBMOUNT, CHIP PACKAGE, AND FABRICATION METHOD THEREOF
- Publication number 20110291153
- Publication date Dec 1, 2011
- Ming-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110285032
- Publication date Nov 24, 2011
- Yu-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110278735
- Publication date Nov 17, 2011
- Yu-Lin YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110278734
- Publication date Nov 17, 2011
- Yu-Lin YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110221070
- Publication date Sep 15, 2011
- Yu-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110193241
- Publication date Aug 11, 2011
- Yu-Lin YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110175236
- Publication date Jul 21, 2011
- Bai-Yao LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110127666
- Publication date Jun 2, 2011
- Chia-Lun TSAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STORAGE CONTAINER FOR DETECTING PRESENCE OF CHECMICAL ELEMENTS
- Publication number 20070275468
- Publication date Nov 29, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Kwang-Chen Wu
- G01 - MEASURING TESTING
Information Patent Application
Production and packaging control for repaired integrated circuits
- Publication number 20070111402
- Publication date May 17, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Long-Sheng YEOU

Person

Patents Grantslast 30 patents

Chip package and method for forming the same

Chip package and method for forming the same

Semiconductor stack structure and fabrication method thereof

Fabrication method for a chip package

Chip package and method for forming the same

Chip package

Chip package

Chip package and fabrication method thereof

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for fabricating the same

Storage container for detecting presence of checmical elements

Production and packaging control for repaired integrated circuits

Method of forming undoped/in-situ doped/undoped polysilicon sandwic...

Two-step planarization process using chemical-mechanical polishing...

Patents Applicationslast 30 patents

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STACK STRUCTURE AND FABRICATION METHOD THEREOF

CHIP SUBMOUNT, CHIP PACKAGE, AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE AND FABRICATION METHOD THEREOF

STORAGE CONTAINER FOR DETECTING PRESENCE OF CHECMICAL ELEMENTS

Production and packaging control for repaired integrated circuits