Longqiang Zu

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Palo Alto, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate differential impedance optimization for 25 to 60...
- Patent number 10,410,984
- Issue date Sep 10, 2019
- SARCINA TECHNOLOGY LLC
- Longqiang Zu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate differential impedance optimization for 25 to 60...
- Patent number 10,276,519
- Issue date Apr 30, 2019
- SARCINA TECHNOLOGY LLC
- Longqiang Zu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate differential impedance optimization for 25 GBPS a...
- Patent number 9,666,544
- Issue date May 30, 2017
- SARCINA TECHNOLOGY LLC
- Longqiang Zu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for packaging semiconductor device
- Patent number 8,278,145
- Issue date Oct 2, 2012
- Global Unichip Corporation
- Chien-Wen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package device with cavity structure and the packagin...
- Patent number 8,247,909
- Issue date Aug 21, 2012
- Global Unichip Corporation
- Longqiang Zu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for adapting solder column to warped substrate
- Patent number 8,152,048
- Issue date Apr 10, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Longqiang Zu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE DIFFERENTIAL IMPEDANCE OPTIMIZATION FOR 25 TO 60...
- Publication number 20170229407
- Publication date Aug 10, 2017
- Sarcina Technology LLC
- Longqiang Zu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE SUBSTRATE DIFFERENTIAL IMPEDANCE OPTIMIZATION FOR 25 GBPS A...
- Publication number 20160358866
- Publication date Dec 8, 2016
- Sarcina Technology LLC
- Longqiang Zu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor package device with cavity structure and the packagin...
- Publication number 20120146218
- Publication date Jun 14, 2012
- Global Unichip Corporation
- Longqiang Zu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging semiconductor device
- Publication number 20120021564
- Publication date Jan 26, 2012
- Global Unichip Corporation
- Chien-Wen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Structure for Adapting Solder Column to Warped Substrate
- Publication number 20100143656
- Publication date Jun 10, 2010
- Longqiang Zu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR