Loo L. Teoh

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Inspection for alignment between IC die and package substrate
- Patent number 7,030,772
- Issue date Apr 18, 2006
- Advanced Micro Devices, Inc.
- Swee Peng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boat for organic and ceramic flip chip package assembly
- Patent number 6,488,158
- Issue date Dec 3, 2002
- Advanced Micro Devices, Inc.
- Mohammad Khan
- H01 - BASIC ELECTRIC ELEMENTS